Copper Pastes & Inks

Dycotec Materials offer a range of copper pastes and inks that have been developed for a broad range of applications including; biomedical sensors, automotive, electrodes, aerospace, touch-screens and thin-film photovoltaic. Our copper pastes use ultrafine and nanomaterial powders enabling excellent electrical conductivities to be achieved whilst providing a cost effective solution. Our copper pastes are primarily designed for flat-bed and rotary screen printing but can be readily modified to suit other deposition techniques. We also provide nanocopper based inkjet systems, that can be sintered using flash lamp or laser systems.

We provide our copper pastes and inks to a global customer base, offering a flexible delivery service from low volume samples to high volume to meet our customer’s production needs. We can rapidly tailor formulations for specific customer requirements.

Copper Pastes & Inks
ProductDescriptionDeposition MethodSubstratesCuring MethodTypical Resistivity
PDF AvailableRequest a Quotation
DM-CUI-5002Copper conductive for general printed electronics useInkjetTCO-glass, polyimide and paperFlash Lamp or Laser<5imagesRequest a quote
DM-CUP-5054Copper conductive for general printed electronics useScreenPaper, polyimide, glassFlash Lamp or Laser<15imagesRequest a quote
DM-CUP-5056Copper conductive for general printed electronics useScreenPET, polyimide, glassReducing atmosphere eg formic acid<5imagesRequest a quote
DM-CUP-5080NanoCopper conductive for fine line printed electronics useScreenPET, polyimide, glassReducing atmosphere eg formic acid<5imagesRequest a quote
DM-CUP-5100All nanocopper based paste for general printed electronics useScreenPaper, PolyimideFlash Lamp or Laser<12imagesRequest a quote

Benefits of our Copper pastes and ink systems include:

• Excellent stability >6 months
• High-throughput printing performance
• Excellent screen life > 8 hours for screen printing
• Long open time for inkjet printing
• High electrical conductivity <5 mΩ/□/mil
• Excellent adhesion to a broad range of substrates including paper, ITO-glass, polyimide and metals
• Smooth surface post sintering
• High area coverage enabling reduced paste consumption for nanocopper pastes
• Flat bed and rotary screen printing compatibility
• Compatible with flexible substrates using light based sintering in air or reducing gas sintering such as using formic acid (DM-CUP-5056)

Please contact us for further information.  Application information may also be available on request.

Our range of products also include Silver Pastes & Inks; Carbon Pastes; Overcoat Inks & Pastes; Insulator Inks & Pastes; Transparent Conductive Coatings and Conductive Adhesives. For more information, please click on the product of your choice.

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