Welcome to Dycotec Materials

Aqueous-based stretchable encapsulation coating for screen printing protective layers over conductive circuits in wearable devices, sensors, and medical electronics on elastomeric and textile substrates. Electrically insulating formulation protects stretchable conductive layers from abrasion and wash damage; cures at 120–180 °C.

Screen printable silver paste designed for touch screen and display electronics, with excellent adhesion to TCO-coated and plain glass substrates. Supports laser ablation for fine feature definition at low cured film thickness. Cure temperature: 140 °C.

Single-part epoxy thermoset silver paste for screen printing onto PET, FR4, glass, and polyimide substrates. Offers excellent durability under thermal stress, making it well suited to printed heaters and demanding environmental applications. Cure options: 140 °C / 10 min or 185 °C / 1 min.

Flat-bed and rotary screen printable silver paste engineered for OPV (organic photovoltaic) thin-film electrodes and solar cell interconnects. Formulated for chemical compatibility with OPV and TCO-coated substrates. Supports roll-to-roll production at cure temperatures from 120 °C.

Screen printable silver paste with good electrical conductivity for sensor, membrane switch, and general circuit applications on polyimide substrates. Cures at 140 °C, offering a reliable balance of conductivity and adhesion on flexible polymer films.

Low-resistivity thermoset carbon paste for screen printing printed resistors, membrane switches, and flexible circuits on PET and FR4. Achieves a sheet resistance of <30 Ω/□/25µm at 140 °C with 2H pencil hardness for good mechanical durability on flexible substrates.

Mid-range resistivity thermoset carbon paste for screen printing resistive elements, sensor electrodes, and flexible circuits on PET and FR4. Achieves a sheet resistance of <100 Ω/□/25µm at 140 °C with 3H pencil hardness for applications requiring a defined resistance in a durable, flexible printed layer.

High-resistivity thermoset carbon paste for screen printing resistive tracks, touch interfaces, and sensor elements on PET and FR4. Achieves a sheet resistance of <1000 Ω/□/25µm at 140 °C with 3H hardness, suited to applications requiring controlled high resistance in a flexible printed layer.

High-conductivity thermoplastic carbon paste for flat-bed and roll-to-roll screen printing, designed for medical biosensor electrodes and high-volume flexible electronics on PET. Achieves a sheet resistance of <15 Ω/□/25µm with fine line capability to 100 µm (line/space), combining high electrical performance with fast-drying R2R processing at 120 °C.

Few-layer graphene inkjet ink for digitally printing conductive sensor, heater, and barrier layers. Its low polymer content in the cured film delivers high-purity graphene performance for electrical conductivity and water/oxygen barrier protection. Prints on ceramic and glass; sinters at 300–350 °C.

Single-layer graphene inkjet ink for digitally printing high-purity conductive and barrier layers in sensors and heaters. The single-layer graphene structure with low cured-film polymer content maximises intrinsic graphene properties — conductivity, chemical inertness, and barrier performance. Prints on ceramic and glass; sinters at 300–350 °C.

Low-temperature thermoplastic few-layer graphene inkjet ink for digitally printing conductive sensor, heater, and barrier layers on heat-sensitive substrates. Its thermoplastic formulation cures at just 120 °C, enabling graphene performance on PET and other flexible plastics that cannot tolerate high-temperature sintering. Prints by inkjet on PET.

Graphene-carbon hybrid thermoset paste for screen printing conductive sensor, heater, and printed resistor layers at low temperature. The graphene-carbon hybrid delivers good electrical conductivity at <20 Ω/□/25µm with the abrasion resistance and surface smoothness graphene brings to printed films. Prints on FR4, glass, and PET; cures at 140 °C.

Manual syringe dispensing format of the DM-AS-10003 single-part solvent-free silver epoxy conductive adhesive, suited to lower-volume and prototyping assembly of heaters, sensors, and medical devices. Cures at 130–150 °C on flexible low-temperature substrates including textile, polycarbonate (PC), PET, and FR4, staying flexible once cured to absorb thermal expansion mismatch stress between bonded surfaces.

Solvent-free epoxy structural adhesive for screen printing or syringe dispensing bonded joints in printed electronics and sensor assemblies. Provides strong non-conductive structural bonding where mechanical robustness rather than electrical continuity is required. Cures at 140 °C with excellent adhesion to glass and PET.

Stretchable screen printable insulator for encapsulating and electrically isolating conductive layers in wearable devices, sensors, and medical electronics on elastomeric and textile substrates. Suitable for multilayer and crossover structures in stretchable circuit constructions; cures at 80–140 °C and is compatible with Dycotec stretchable conductive pastes.

Stretchable silver polyurethane conductive adhesive for syringe dispensing, designed to relieve assembly joint stress during stretching and flexing in wearables, In-Mold Electronics (IME), and printed electronics on PET, textile, TPU, and metal substrates. Stretches up to 100% and achieves <20 mΩ/□/25µm when sintered at 140 °C, with a cure window of 80–140 °C; also suitable for products requiring thermoforming.

General-purpose solderable silver cermet paste for screen printing conductor tracks and terminations for chip resistors, potentiometers, and heaters. Its wide firing window centred on 850 °C gives a smooth, dense layer on alumina, glass, dielectric-coated steel, and other ceramics, with excellent electrical conductivity. Mixed bonded system.

Insulating dielectric paste engineered specifically for ferritic 430 stainless steel, forming the base insulation layer for printed heaters and circuits on steel. Fires at 850 °C in an air oxidising atmosphere to a dense layer with excellent breakdown voltage. Screen printed.

Hard, thermally cured screen printable insulator paste for crossover dielectric and protective layers in multilayer printed circuits. Its excellent mechanical hardness suits rigid-substrate sensors and multilayer devices where durability and abrasion resistance matter. Prints on copper, silver, and PET; cures at 120–130 °C.

Low-fire solderable silver cermet paste for screen printing conductors on heat-limited substrates: float glass, enamel coatings, and ceramics. Fires at 525–700 °C, well below standard 850 °C cermet systems, with good adhesion across its wide firing window. Mixed bonded system.

Silver/platinum (1%) solderable cermet paste for screen printing terminations for chip resistors, potentiometers, and heaters. The 1% platinum addition provides solder leach resistance beyond pure silver at lower cost than higher-platinum grades. Fires at 850 °C on alumina, glass, Porcelain Enamel Steel (PES), and other ceramics.

Silver/platinum (2%) solderable cermet paste for screen printing terminations for chip resistors, potentiometers, and heaters. The 2% platinum content balances solder leach resistance against cost, the mid-point of the Ag/Pt range. Fires at 850 °C on alumina, glass, Porcelain Enamel Steel (PES), and other ceramics.

Biocompatible thermoplastic carbon paste for screen printing on elastomeric and textile substrates, designed for skin-contact wearables, ECG/EMG sensors, heaters, and medical devices requiring >200% stretchability. Achieves ~60 Ω/□/25µm at 130 °C; tested to ISO 10993-5 for biocompatibility. Typically overprinted on silver layers to improve durability and washability

TPU-optimised biocompatible thermoplastic carbon paste for screen printing on polyurethane substrates, designed for skin-contact wearables, sensors, heaters, and medical devices requiring >150% stretchability. Achieves ~60 Ω/□/25µm at 130 °C; tested to ISO 10993-5 for biocompatibility. Formulated specifically for adhesion and compatibility with TPU substrate chemistry.

Screen and stencil printable phase change material (PCM) thermal paste delivering 1.75 W/m·K, the printable option where dispensing is impractical. A PCM additive softens at approximately 55 °C in service, flowing to fill interface voids and displace trapped air for low thermal interface resistance between power devices and heat sinks, heat spreaders, or heat pipes. Prints on aluminium heat sinks, PCB, and semiconductor device surfaces.

Translucent stretchable insulator coating for screen printing protective and insulating layers in wearable devices, sensors, and medical electronics on TPU, textile, and PET substrates. The translucent finish suits applications where the underlying circuit or substrate appearance must remain visible. Stretches to >50%; cures at 120–150 °C.

2.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, and the silicone-free chemistry eliminates the oil leach and migration that can contaminate optical and electrical surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces.

2.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, and the silicone-free chemistry eliminates the oil leach and migration that can contaminate optical and electrical surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces.

3.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration onto sensitive surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces.

3.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration onto sensitive surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces.

4.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces.

4.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces.

5.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in higher heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces.

5.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in higher heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces.

6.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in high heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces.

6.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in high heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces.

Silver/platinum (3%) solderable cermet paste for screen printing terminations for chip resistors, potentiometers, and heaters. The 3% platinum content gives strong solder leach resistance for repeated soldering operations and demanding assembly. Fires at 850 °C on alumina, glass, Porcelain Enamel Steel (PES), and other ceramics.

Insulating dielectric paste engineered specifically for austenitic 304 stainless steel, forming the base insulation layer for printed heaters and circuits on steel. Fires at 850 °C in an air oxidising atmosphere to a dense layer with excellent breakdown voltage. Screen printed; matched to 304’s thermal expansion where the 430-grade DM-INS-14100 is not suitable.

Cost-effective silver resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 100 mΩ/□ at 20 µm fired thickness with a TCR of 3300 ppm/°C, useful where resistance rise with temperature aids self-regulation. Fires at 850 °C.

Silver/platinum (<2.0%) resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 100 mΩ/□ at 20 µm fired thickness with a reduced TCR of 2000 ppm/°C for more stable resistance across operating temperature than pure silver systems. Fires at 850 °C.

Screen and stencil printable phase change material (PCM) thermal paste delivering 3.3 W/m·K, compared with 1.75 W/m·K for DM-TIM-15203S. A PCM additive softens at approximately 55 °C in service, flowing to fill interface voids and displace trapped air for low thermal interface resistance between power devices and heat sinks, heat spreaders, or heat pipes. Prints on aluminium heat sinks, PCB, and semiconductor device surfaces.

Silver/palladium solderable cermet paste for screen printing terminations for chip resistors, potentiometers, and heaters. Palladium addition provides solder leach resistance for repeated assembly operations. Fires at 850 °C with a smooth, dense layer on alumina, glass, Porcelain Enamel Steel (PES), and other ceramics.

Screen printable silver paste for bus bar formation in SPD (Suspended Particle Devices) and PDLC (Polymer Dispersed Liquid Crystals) smart glass applications. Provides excellent adhesion to TCO-coated and plain glass substrates, with consistent line definition at cure temperature of 140 °C.

High-viscosity silver ink for pressure-time dispensing (syringe printing), designed for PDLC smart glass bus bar formation and edge connection applications. Compatible with TCO-coated and plain glass substrates. Cures between 100–140 °C with excellent adhesion to transparent conductive oxide surfaces.

Single-part thermally conductive epoxy adhesive delivering 2.3 W/m·K in manual syringe format for prototyping and low-volume assembly. Bonds and conducts heat simultaneously while providing high voltage isolation, removing the need for separate mechanical fixings and thermal pads. Cures at 150 °C on heat sinks, LEDs, and semiconductor device surfaces.

Stretchable two-part epoxy underfill for syringe dispensing, designed for capillary underfilling of chip-scale packages and electronic components in IME and hybrid printed electronics assemblies. Transparent formulation is well suited to LED applications; low-temperature cure and stretchability minimise joint stress during thermoforming and injection molding while increasing component bond strength.

Hydrophobic screen printable carbon paste for printing ion-selective electrodes (ISE) in electrochemical biosensors. Its hydrophobic formulation blocks water penetration that would otherwise cause capacitive effects and sensor inaccuracy, suiting wet and submerged sensing. Used with nitrate, potassium, calcium, sodium, magnesium, phosphate, ammonium, and chloride ion measurements when paired with ionophores; applications include agriculture, marine farming, wearables, and water purity monitoring. Cures at 120 °C on PET.

High-elongation stretchable encapsulation coating for screen printing protective and insulating layers in wearable devices, sensors, and medical electronics on TPU and textile substrates. Stretches to approximately 220%, with good breakdown voltage; cures at 80–140 °C.

Hard thermoset silver epoxy paste for screen printing conductive tracks and contact pads in printed biosensors. Its robustness and hardness make it well suited to Zero-Insertion-Force (ZIF) connector interfaces and to sensors operating in hostile environments such as agriculture and marine farming. Prints on paper and PET, and overprints Ag:AgCl reference layers; cures at 135 °C.

Higher-resistance silver/platinum (<1.8%) resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 200 mΩ/□ at 20 µm fired thickness with a TCR of 2000 ppm/°C, suited to heater designs needing higher element resistance in shorter track lengths. Fires at 850 °C.

Low-TCR silver/platinum (2.0%) resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 200 mΩ/□ at 20 µm fired thickness with a TCR of 1500 ppm/°C, the most temperature-stable Ag/Pt grade, for heaters requiring consistent power output across their operating range. Fires at 850 °C.

7.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Suited to demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces.

7.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Suited to demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces.

Bulk packaging format of the DM-TIM-15323 single-part thermally conductive epoxy adhesive (2.3 W/m·K), supplied for customer-specified dispensing equipment and production-scale assembly. Bonds and conducts heat simultaneously while providing high voltage isolation, removing the need for separate mechanical fixings and thermal pads. Cures at 150 °C on heat sinks, LEDs, and semiconductor device surfaces.

Blue thermoset polymer overcoat for screen printing protective layers, solder dams, and marking over thick film resistor and conductor circuits. The blue colour provides visual contrast for inspection and marking, and the paste is solderable for downstream assembly. Prints on ceramic, stainless steel, and PCB; cures at 150–250 °C. Other colours available on request.

High thermal conductivity 8.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. For the most demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces.

High thermal conductivity 3.7 W/m·K single-part epoxy adhesive in manual syringe format. Bonds and conducts heat simultaneously while providing high voltage isolation, removing the need for separate mechanical fixings and thermal pads. Cures at 150 °C on heat sinks, LEDs, and semiconductor device surfaces.

Nanocarbon inkjet ink for digitally printing conductive tracks, sensor electrodes, and heater elements across a broad substrate range including PET, PI, PEN, PEEK, ITO-PET, ITO-glass, and soda lime glass. Cures at 100 °C with excellent dispersion stability, suited to low-temperature substrates and fine-feature inkjet deposition.

Typically supplied as a kit with 500 g flushing solution (DM-CLN-3000).

Water-resistant stretchable insulator for screen printing encapsulation layers in ECG/EMG, heater, sensor, and medical wearable applications on TPU, textile, and PET substrates. Stretches to 60% with excellent moisture resistance; cures at 80–120 °C and is compatible with Dycotec stretchable conductive pastes

High-sensitivity screen printable carbon paste for printing screen-printed electrodes (SPE) in electrochemical biosensors. Its excellent charge-transfer properties suit working electrodes in enzymatic, DNA, and immunosensor applications where signal sensitivity is critical. Prints on PET and cures at 100–120 °C.

Flexible screen printable overcoat and insulator paste for protecting printed biosensor circuitry. Defines and seals the active sensing area while insulating surrounding conductive tracks from the sample environment. Prints on PET with a low cure temperature of 70–100 °C, suiting heat-sensitive substrates and reagents.

Silver/palladium (2.0%) resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 100 mΩ/□ at 20 µm fired thickness with a low TCR of 1500 ppm/°C, combining standard element resistance with strong temperature stability. Fires at 850 °C.

Cost-effective screen printable silver paste offering excellent electrical conductivity at low silver loading, designed for flexible hybrid electronics, RFID antennas, and membrane keypads. Compatible with PET and polyimide at cure temperatures of 120–150 °C. Formulated for compatibility with Dycotec’s full range of flexible printed electronics inks.

High thermal conductivity 8.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. For the most demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces.

Screen printable carbon paste for flexible circuits on PET, used to protect silver conductive traces and reinforce silver pad durability at flex circuit tail contact points. Can be blended with DM-SIP-3074S silver paste to produce hybrid carbon-silver formulations with tailored sheet resistances. Compatible with Dycotec UV-curable dielectric inks. Cures at 100–120 °C.

Aqueous-based thermoplastic carbon paste for screen printing stretchable overprint layers on elastomeric and textile substrates in wearables, sensors, and medical devices. Achieves <20 Ω/□/25µm with an environmentally friendly water-based formulation; typically applied over silver conductive layers to improve durability and washability. Compatible with DM-ENC-2500 and DM-INS-2501 encapsulants.

Wash-durable thermoplastic silver paste for screen printing on elastomeric and textile substrates, withstanding up to 50 wash cycles when used with Dycotec encapsulant pastes. Achieves <10 mΩ/□/25µm across a wide cure range of 80–200 °C with >20% stretchability, suited to smart garments, ECG/EMG sensors, and medical wearables where long-term conductivity retention through laundering is critical.

Cost-effective thermoplastic silver paste for screen printing stretchable circuits on textiles, PET, and elastomeric substrates for wearables, sensors, and medical devices. Achieves <10 mΩ/□/25µm at 120–140 °C with ~60% elongation, 5B adhesion, and no resistance increase after crease testing; washable when used with Dycotec encapsulant pastes. For TPU substrates use DM-SIP-2005PU.

TPU-optimised thermoplastic silver paste for screen printing stretchable circuits on polyurethane substrates for wearables, sensors, and medical devices. Achieves <13 mΩ/□/25µm at 130 °C with up to 80% elongation and high surface coverage (247 cm²/g at 6 µm), offering a cost-effective formulation specifically matched to TPU substrate chemistry.

High-elongation thermoplastic silver paste for screen printing on elastomeric and textile substrates, offering up to 170% stretch (>300% when laminated) for demanding sensor and wearable device applications. Achieves <22 mΩ/□/25µm at 130 °C with good washability and low silver content for cost-effective large-area stretchable circuit production.

High-elongation thermoplastic silver paste for screen printing on elastomeric and textile substrates, offering up to 170% stretch (>300% when laminated) for demanding sensor and wearable device applications. Achieves <22 mΩ/□/25µm at 130 °C with good washability and low silver content for cost-effective large-area stretchable circuit production.

Translucent UV-cured screen printable insulator paste for crossover dielectric and protective layers on flexible substrates. The translucent finish suits applications where underlying circuitry or graphics must remain visible, such as automotive controls, membrane keyboards, heaters, and sensors. Prints on PET; UV cure.

Blue-translucent UV-cured screen printable insulator paste for crossover dielectric and protective layers on flexible substrates. The blue tint provides visual print verification and registration contrast during multilayer printing while remaining translucent, suiting automotive controls, membrane keyboards, heaters, and sensors. Prints on PET; UV cure.

Green-translucent UV-cured screen printable insulator paste for crossover dielectric and protective layers on flexible substrates. The green tint provides visual print verification and layer-registration contrast during multilayer printing while remaining translucent, suiting automotive controls, membrane keyboards, heaters, and sensors. Prints on PET; UV cure.

Multilayer dielectric paste for screen printing crossover and interlayer insulation in hybrid circuits on alumina. Fires at 850 °C to a non-porous, dense layer, and is compatible with Dycotec silver and gold conductor pastes for multilayer circuit stacks. REACH compliant.

White thermoset polymer overcoat for screen printing protective layers, solder dams, and marking over thick film resistor and conductor circuits. The white colour gives high-contrast legend and marking legibility, and the paste is solderable for downstream assembly. Prints on ceramic, FR4, stainless steel, and PCB; cures at 150–250 °C