Assembly Materials

Stencil and screen printing format of the DM-SAS-10030 flexible silver ECA, designed for higher-throughput component attachment in IME, wearables, sensors, and medical devices on PET, TPU, and textile substrates. Maintains joint flexibility when cured at 120 °C, achieving <200 mΩ/□/25µm with fine pitch resolution suited to dense component layouts.

Pressure-time dispensing format of the DM-AS-10003 single-part solvent-free silver epoxy conductive adhesive, optimised for automated dispensing in heater, sensor, and medical device assembly. Cures at 130–150 °C on flexible low-temperature substrates including textile, polycarbonate (PC), PET, and FR4, staying flexible once cured to absorb the stress caused by thermal expansion mismatch between bonded surfaces.

Manual syringe dispensing format of the DM-SAS-10030 flexible silver ECA, suited to lower-volume or prototyping assembly of IME, wearables, sensors, and medical devices on PET, TPU, and textile substrates. Maintains joint flexibility when cured at 120 °C, achieving <250 mΩ/□/25µm with fine pitch resolution and shear strength of ~50 kg/cm².

Pressureless nanosilver sintering die attach paste for screen or stencil printing die bonds in wide-bandgap power electronics and optoelectronics. Sintering at 250 °C without applied pressure simplifies assembly while delivering die shear strength above 20 MPa. Used for flip chip attachment in silicon carbide (SiC) and gallium nitride (GaN) IGBT power modules, LED packaging, and high-speed optical network devices on copper, gold, and silver metallisation.

UV-curable barrier adhesive for roll-to-roll (R2R) rotary screen lamination of flexible perovskite (PSC) and organic photovoltaic (OPV) solar cells on PET. High moisture barrier properties protect moisture-sensitive perovskite and organic active layers, extending device lifetime, while rapid UV cure suits continuous high-throughput R2R production.