We are delighted to announce that Dr Richard Dixon will be an invited speaker at the prestigious AWA (Alexander Watson Associates) virtual IMECON conference on 27th May 2021.  We will present on latest developments on functional materials needed for In-Mold Electronics.  The conference agenda is now available.

Please email us directly at info@dycotecmaterials.com for more information on our IME product portfolio range or to arrange a time to discuss your requirements with our technical team.

 

AWA-Dycotec-In-Mold-electronics

Applications

9

Smart Glass

Our high electrical conductivity and durable conductive materials are used in the fabrication of the electronic bus-bar strips for smart windows use.

9

Heaters

Our overcoat, conductive adhesive and conductive inks are tailored for use in either transparent or more standard printed heater coils.

9

Antenna

The use of our high electrical conductivity copper, silver or carbon inks ensures that high frequency antenna systems can be cost effectively manufactured.

9

Printed Circuit Board

Our high performance conductive inks and adhesive materials, which are capable of withstanding high temperature processing can be used in the manufacture of printed circuit boards.

9

In-Mold Electronics

Our extensive product portfolio provides all the necessary material sets required for In-Mold Electronics

9

Sensors

Our high electrical conductivity and durable conductive materials are used in the fabrication of the electronic bus-bar strips for smart windows use.

9

Solar / Photovoltaic

Our conductive and insulating materials offer long lifetime performance for use in the manufacture of high efficiency thin film solar cells.

9

Display

Our overcoat materials used in combination with our conductive silver and copper based conductive materials are used in OLED and Touch displays.
Our materials utilise an environmentally friendly and cost effective additive approach.

9

Wearable/Stretchable

We provide a portfolio of inks for use in wearable technology including stretchable and washable conductive inks, encapsulants and adhesives