Dycotec Materials will present their All Copper Interconnect technology as an invited speaker at the International Microelectronics, Assembly and Packaging Society (IMAPS-UK) online conference on the 28th May.

Dycotec have developed a new assembly material based on nanocopper materials with improved electrical conductivity compared to standard solderpastes without the electromigration issues associated with more expensive silver based systems.  this builds on Dycotec’s range of copper based conductive inks.

For further information, please do not hesitate to contact us at info@dycotecmaterials.com.

Abstract: Introducing the All-Copper Interconnect Technology

Digital technologies underpin innovation and competitiveness and are essential to any society and industry. With the stalling of Moore’s law and the introduction of disruptive technologies, such as cloud-computing, mobile applications, electric vehicles (EV), internet-of-things (IOT) and wearables, the importance of electronic packaging is increasing.  A main issue in electronic system integration is the interconnect density gap between the on-chip and the on-PCB wiring, with an order of magnitude difference. Lines can be made with submicron dimensions on chip level with tools of foundries whereas linewidths <50 µm are challenging to make with tools of PCB manufacturers. Hence, costly and complex technologies like Fan-Out wafer Level Packaging and 3D-Integration, demanding significant investments in tooling, are used. Dycotec Materials working in partnership with IBM have shown that alternative paths suited for manufacturing exists. Wiring and interconnect formation can be made using high-resolution additive manufacturing with copper nanoparticle based materials. This approach offers superior electrical conductivity to traditional solderpastes, achieving bulk like copper performance whilst offering a more cost effective solution and lower electromigration than assembly materials based on nanosilver. 

Applications

9

Smart Glass

Our high electrical conductivity and durable conductive materials are used in the fabrication of the electronic bus-bar strips for smart windows use.

9

Heaters

Our overcoat, conductive adhesive and conductive inks are tailored for use in either transparent or more standard printed heater coils.

9

Antenna

The use of our high electrical conductivity copper, silver or carbon inks ensures that high frequency antenna systems can be cost effectively manufactured.

9

Printed Circuit Board

Our high performance conductive inks and adhesive materials, which are capable of withstanding high temperature processing can be used in the manufacture of printed circuit boards.

9

Sensors

Our high electrical conductivity and durable conductive materials are used in the fabrication of the electronic bus-bar strips for smart windows use.

9

Solar / Photovoltaic

Our conductive and insulating materials offer long lifetime performance for use in the manufacture of high efficiency thin film solar cells.

9

Display

Our overcoat materials used in combination with our conductive silver and copper based conductive materials are used in OLED and Touch displays.
Our materials utilise an environmentally friendly and cost effective additive approach.