Dycotec Materials release In-Mold Electronic (IME) ink product portfolio
We are delighted to announce the launch of our new In-Mold Electronic (IME) ink product portfolio.
In-Mold Electronics offers a revolutionary new process to produce lightweight and thin profile electronics for sectors such as automotive, aerospace and consumer electronics. Manufacturing process steps combine 2D printing and SMT component assembly with thermoforming and injection molding to produce 3D electronic circuits. Our new product range includes:
- High conductivity silver paste for interconnect circuitry with excellent thermoformability, printability and durability
- Dielectric cross-over materials that offer excellent protection against shunt resistance formation
- Conductive Adhesives that provide flexibility to avoid the stress failures observed in more rigid epoxy based conductive adhesive systems whilst maintaining excellent adhesive properties
- Conductive Carbon pastes to overprint silver conductive traces for extended durability
The inks have been launched after successful testing at number of beta site customers. Both sample and high volumes are immediately available. We work in close collaboration with our customers and support customisation of inks if needed.
More information is available on Dycotec Materials In-Mold Electronics product portfolio.
Or please email us directly at info@dycotecmaterials.com for more information.
