Epoxy Encapsulant & Underfill Adhesives for Electronics Assembly
View our Encapsulant & Underfill products...
We provide screen printed electrically insulating adhesives. These materials are solvent free allowing large areas to be processed. For use on plastic substrates such as PET. Applications include sensors and flexible electronics.
Dycotec supply a range of encapsulants and underfills. These materials can be processed from syringe, manually or by pressure-time automated dispense, or screen/stencil printed. We provide a range of general purpose epoxy systems to polyurethane systems that are flexible and stretchable. Applications include flexible electronics, In-Mold Electronics (IME), batteries and wearable technology.
| Name | Description | Applications | Key Features | Deposition Method | Substrates | Processing Temperature (°C) | Datasheet | hf:tax:pa_applications | hf:tax:pa_deposition-method | hf:tax:pa_substrate |
|---|---|---|---|---|---|---|---|---|---|---|
| DM-ENC-2500 | Aqueous-based stretchable encapsulation coating for screen printing protective layers over conductive circuits in wearable devices, sensors, and medical electronics on elastomeric and textile substrates. Electrically insulating formulation protects stretchable conductive layers from abrasion and wash damage; cures at 120–180 °C. | Wearables | Stretchable | Screen | Textile | 120 - 180 |  | wearables | screen | textile |
| DM-UFL-16001 | Stretchable two-part epoxy underfill for syringe dispensing, designed for capillary underfilling of chip-scale packages and electronic components in IME and hybrid printed electronics assemblies. Transparent formulation is well suited to LED applications; low-temperature cure and stretchability minimise joint stress during thermoforming and injection molding while increasing component bond strength.
| In-Mold Electronics, Wearables | Stretchable, Transparent, Washable | Manual Syringe | Polycarbonate PC, Textile, TPU | 120 - 180 | | in-mold-electronics wearables | manual-syringe | pc textile tpu |
Benefits of our encapsulants and underfills:
- Underfill systems available with excellent thermal conductivity
- Washable encapsulant systems available
- Range of systems with different mechanical properties including flexible and stretchable systems
- Compatible with a wide range of substrates
- RoHS Compliant
- Customised systems can be developed
We can supply materials very rapidly, with typical shipping times within 5 - 10 days.
