In-Mold Electronics (IME) Conductive Inks & Pastes
View our In-Mold Electronics products...
In-Mold Electronics (IME) inks and pastes enable electronic circuits to be printed onto flat plastic films, then thermoformed and injection molded into finished 3D components. This allows lighting, heating, antennas, capacitive touch sensors, actuators, and displays to be seamlessly integrated into curved parts for automotive interiors, aerospace panels, and white goods, replacing conventional switch and circuit assemblies.
Dycotec Materials provides a complete In-Mold Electronics material portfolio covering thermoformable silver and carbon conductive pastes, crossover dielectric insulators, flexible conductive adhesives, and stretchable underfill encapsulants. Multi-layer constructions combining functional IME inks with graphic ink layers deliver lighter-weight, thinner form factors and more cost-effective, sustainable components than conventional electronic assembly.
Although other substrates are supported, our IME materials are formulated primarily for polycarbonate substrates, with conductive adhesive and underfill options.
Our materials are processed using high-volume production techniques such as screen, stencil and syringe printing. Various packaging options are available. Using our pilot line operations, including industrial screen printers, 3-axis pressure-time dispense, surface mount technology lines and thermoforming tools, we rigorously test materials to replicate our customer volume production processes.
| Name | Description | Applications | Key Features | Deposition Method | Substrates | Processing Temperature (°C) | Datasheet | hf:tax:pa_applications | hf:tax:pa_deposition-method | hf:tax:pa_substrate |
|---|---|---|---|---|---|---|---|---|---|---|
| DM-SAS-10030-ST | Stencil and screen printing format of the DM-SAS-10030 flexible silver ECA, designed for higher-throughput component attachment in IME, wearables, sensors, and medical devices on PET, TPU, and textile substrates. Maintains joint flexibility when cured at 120 °C, achieving <200 mΩ/□/25µm with fine pitch resolution suited to dense component layouts. | Flexible Electronics, In-Mold Electronics | Flexible, Withstand overmolding | Screen, Stencil | PET, Polycarbonate PC | 120 |  | flexible-electronics in-mold-electronics | screen stencil | pet pc |
| DM-SIP-1005 | Thermoformable thermoplastic silver paste for screen printing IME circuits on polycarbonate, designed for lighting, capacitive touch, antenna, heating, and display applications in automotive, aerospace, and white goods. Balances excellent thermoformability with reliable electrical conductivity (<40 mΩ/□/25µm), with long screen residence times suited to high-volume production. Cure temperature: 110–130 °C. | Aerospace, Automotive, Domestic Appliances | <40mΩ/□/25µm | Screen | Polycarbonate PC | 110 - 130 | | aerospace automotive domestic-appliances | screen | pc |
| DM-SIP-1006 | High-conductivity thermoplastic silver paste for screen printing multilayer IME circuits on polycarbonate, where maximum electrical performance is the priority over thermoformability. Achieves 15 mΩ/□/25µm — the highest conductivity in the Dycotec IME range — and is compatible with thermoforming and overmolding processes on circuit areas without sharp geometry gradients. Cure temperature: 110–130 °C. | Aerospace, Automotive, Domestic Appliances | 15 mΩ/□/25µm | Screen | Polycarbonate PC | 110 - 130 | | aerospace automotive domestic-appliances | screen | pc |
| DM-INS-1506 | Thermoformable screen printable dielectric paste for crossover insulation in multilayer IME circuit designs on polycarbonate. Provides breakdown voltage exceeding 31 kV/mm with two printed layers, offering cost-effective electrical isolation between conductive traces in lighting, touch sensor, antenna, and display applications. Compatible with thermoforming and injection overmolding processes. | Aerospace, Automotive, Domestic Appliances | dielectric cross over require print thickness>20µm, Require minimum 2 prints | Screen | Polycarbonate PC | 100 | | aerospace automotive domestic-appliances | screen | pc |
| DM-UFL-16001 | Stretchable two-part epoxy underfill for syringe dispensing, designed for capillary underfilling of chip-scale packages and electronic components in IME and hybrid printed electronics assemblies. Transparent formulation is well suited to LED applications; low-temperature cure and stretchability minimise joint stress during thermoforming and injection molding while increasing component bond strength.
| In-Mold Electronics, Wearables | Stretchable, Transparent, Washable | Manual Syringe | Polycarbonate PC, Textile, TPU | 120 - 180 | | in-mold-electronics wearables | manual-syringe | pc textile tpu |
| DM-SAS-10030-SY | Pressure-time dispensing format of the DM-SAS-10030 flexible silver ECA, optimised for automated dispensing systems in IME, wearables, sensors, and medical device assembly on PET, TPU, and textile substrates. Maintains joint flexibility when cured at 120 °C, achieving <250 mΩ/□/25µm with fine pitch resolution and shear strength of ~50 kg/cm². | Flexible Electronics, In-Mold Electronics | Flexible, Withstand overmolding | Pressure-Time Dispense | PET, Polycarbonate PC | 120 | | flexible-electronics in-mold-electronics | pressure-time-dispense | pet pc |
| DM-SAS-10030-SYP | Manual syringe dispensing format of the DM-SAS-10030 flexible silver ECA, suited to lower-volume or prototyping assembly of IME, wearables, sensors, and medical devices on PET, TPU, and textile substrates. Maintains joint flexibility when cured at 120 °C, achieving <250 mΩ/□/25µm with fine pitch resolution and shear strength of ~50 kg/cm². | Flexible Electronics, In-Mold Electronics | Flexible, Withstand overmolding | Manual Syringe | PET, Polycarbonate PC | 120 | | flexible-electronics in-mold-electronics | manual-syringe | pet pc |
| DM-CAP-1061S | Thermoformable thermoplastic carbon paste for flat-bed screen printing of conductive tracks in IME applications including lighting, touch sensors, antennas, and heating elements on polycarbonate. Achieves a sheet resistance of 40 Ω/□/25µm at 120 °C with 250 µm line/space resolution and 5B adhesion, suited to multilayer IME circuit constructions alongside Dycotec silver IME pastes. | Aerospace, Automotive, Domestic Appliances | 40Ω/□/25µm | Screen | Polycarbonate PC | 80 - 120 | | aerospace automotive domestic-appliances | screen | pc |
In-Mold Electronics Expertise from Dycotec Materials
Dycotec Materials has developed conductive and insulating material systems for In-Mold Electronics used across automotive, aerospace, and domestic appliance manufacturing. Our engineering team works closely with customers to balance electrical conductivity against thermoformability, and to optimise adhesion, print resolution, curing conditions and long-term durability for each application.
Because IME applications vary widely in thermoformed geometry, graphic ink selection, molding conditions, and print processes, we work in partnership with our customers to ensure swift adoption of our In-Mold Electronic inks into high-volume production, including customisation where needed. This support spans concept and prototype development through to commercial manufacture.
What Are In-Mold Electronics Inks?
In-Mold Electronics inks are functional printable materials, including conductive, dielectric, and adhesive formulations, engineered to survive the thermoforming and injection molding processes used to convert printed flat films into 3D parts. Unlike standard printed electronics inks, IME materials must stretch and deform with the substrate during forming without cracking or losing electrical performance.
A typical IME construction is built up in layers on a plastic film such as polycarbonate. Conductive silver or carbon tracks are screen printed and cured at relatively low temperatures (typically 100–130 °C), dielectric layers provide crossover insulation between traces, conductive adhesives attach components such as LEDs, and underfill encapsulants protect component joints during molding.
Depending on the application, formulations may be optimised for maximum electrical conductivity, thermoformability, breakdown voltage, joint flexibility, or compatibility with graphic ink layers and specific molding conditions.
For a step-by-step explanation of how these materials are printed, thermoformed, and injection molded into finished parts, including a real automotive lighting case study, see our In-Mold Electronics application page.
Applications and Industries Using In-Mold Electronics Inks
In-Mold Electronics inks are used wherever electronic functionality needs to be integrated into 3D plastic components. Common applications include capacitive touch controls, backlighting and lighting elements, printed heaters, antennas such as RFID structures, sensors, actuators, and display integration. Where components such as LEDs and ICs are mounted onto the printed film, IME overlaps closely with printed hybrid electronics. See our In-Mold Electronics application page for more detail on how these constructions are built.
The principal industries adopting IME are automotive (interior control panels, overhead consoles, and smart surfaces), aerospace and defence (lightweight cabin controls and panels), and white goods and domestic appliances (seamless touch interfaces on curved housings). By replacing mechanical switches and wire harnesses with printed structures, IME reduces part count, weight, and assembly complexity while enabling sleek, sealed, easy-to-clean surfaces.
Why Use In-Mold Electronics Inks?
In-Mold Electronics allows manufacturers to combine decoration, structure, and electronic function in a single molded part. Circuits are printed on flat films using established, high-throughput screen printing processes, then formed and molded into the final 3D shape, which is significantly more efficient than assembling rigid PCBs, switches, and connectors into a housing.
Compared with conventional electronic assembly, IME components are lighter in weight, thinner in form factor, and more cost effective. Fewer discrete parts means fewer failure points, and the printed circuitry is fully encapsulated within the molded component, protecting it from moisture, wear, and vibration.
Dycotec IME materials are designed as a compatible system. Conductive pastes, crossover dielectrics, conductive adhesives, and underfill encapsulants are routinely tested together and with commonly used graphic ink layers, so multilayer constructions can be built with confidence. Flexible adhesive systems overcome the stress-related failures observed with more rigid epoxy-based conductive adhesives during molding.
The technology is proven in high-volume production. Long screen residence times support extended print runs, and extensive durability analysis underpins performance in demanding automotive and aerospace environments.
Applications and Industries Using In-Mold Electronics Inks
In-Mold Electronics inks are used wherever electronic functionality needs to be integrated into 3D plastic components. Common applications include capacitive touch controls, backlighting and lighting elements, printed heaters, antennas such as RFID structures, sensors, actuators, and display integration. Where components such as LEDs and ICs are mounted onto the printed film, IME overlaps closely with printed hybrid electronics. See our In-Mold Electronics application page for more detail on how these constructions are built.
The principal industries adopting IME are automotive (interior control panels, overhead consoles, and smart surfaces), aerospace and defence (lightweight cabin controls and panels), and white goods and domestic appliances (seamless touch interfaces on curved housings). By replacing mechanical switches and wire harnesses with printed structures, IME reduces part count, weight, and assembly complexity while enabling sleek, sealed, easy-to-clean surfaces.
How to Choose an In-Mold Electronics Ink
The central selection decision for IME conductive pastes is the balance between electrical conductivity and thermoformability. Formulations with the highest conductivity are best suited to molded features without sharp geometry gradients, while formulations optimised for thermoformability handle deeper draws and more demanding 3D shapes with proven high-volume printability.
For multilayer designs, crossover dielectric selection is driven by breakdown voltage requirements and print thickness, with cost-effective isolation achievable in two printed layers. Component attachment requires flexible conductive adhesives compatible with injection molding, available in stencil, screen, pressure-time dispense, and manual syringe formats to suit production volume. Joint strength and reliability can be further improved by pairing the adhesive with a stretchable insulating underfill.
Substrate compatibility, cure temperature, line resolution, graphic ink compatibility, and molding conditions all influence the final choice. Dycotec Materials works closely with customers to identify the most appropriate IME material set for their application, manufacturing process, and performance objectives. Where a standard product is not an exact fit, our custom formulation services can tailor materials to your thermoformed geometry, graphic ink stack, and molding conditions, supported by prototyping and development services to validate performance before scale-up.
In-Mold Electronics Inks Designed for Scalable Manufacturing
Dycotec IME materials are developed for industrial manufacturing environments using flat-bed screen printing, stencil printing, and automated dispensing processes, followed by standard thermoforming and injection molding equipment.
Paste rheology and solvent systems are controlled to deliver long screen residence times, minimising manufacturing issues such as screen blocking and inconsistent line definition during extended production runs. Conductive adhesives are offered in formats matched to production scale, from manual syringe for prototyping through to pressure-time dispensing for automated assembly lines.
Our applications laboratory supports prototype and pilot-scale evaluations under realistic manufacturing conditions, including thermoforming and overmolding trials, allowing customers to validate material performance before scaling to production volumes.
Frequently Asked Questions About In-Mold Electronics Inks
What substrates are compatible with In-Mold Electronics inks?
Dycotec IME conductive pastes and dielectrics are formulated primarily for polycarbonate, the most widely used IME substrate. Conductive adhesives and underfill encapsulants in the portfolio also support PET, TPU and textile substrates for related flexible and hybrid electronics assemblies.
What printing methods are used for In-Mold Electronics inks?
Conductive and dielectric IME pastes are deposited by flat-bed screen printing. Conductive adhesives are available in stencil and screen printing formats for higher-throughput component attachment, pressure-time dispensing for automated assembly, and manual syringe formats for lower-volume or prototyping work.
How are In-Mold Electronics inks cured?
IME materials are thermally cured at relatively low temperatures, typically in the range of 100–130 °C for conductive and dielectric pastes, making them compatible with plastic film substrates. Curing establishes the conductive pathways and dielectric properties before the printed film is thermoformed and molded.
What conductivity can In-Mold Electronics inks achieve?
Dycotec thermoformable silver pastes achieve sheet resistance down to 15 mΩ/□/25 µm, the highest conductivity in the range, with thermoformability-optimised silver grades below 40 mΩ/□/25 µm. Thermoformable carbon pastes achieve around 40 Ω/□/25 µm for resistive tracks and lower-cost conductive layers.
Do In-Mold Electronics inks survive thermoforming and injection molding?
Yes. Dycotec IME materials are specifically engineered to withstand thermoforming and injection overmolding. Conductive pastes are evaluated for electrical performance after forming, and flexible conductive adhesives overcome the stress-related joint failures observed with rigid epoxy-based systems during molding.
Are In-Mold Electronics inks compatible with graphic ink layers?
Yes. Dycotec IME materials have proven compatibility with commonly used graphic ink layers, allowing decorative and functional layers to be combined in a single multilayer construction. Because graphic ink systems vary between manufacturers, compatibility is confirmed with customers during process development.
How is crossover insulation achieved in multilayer IME circuits?
Thermoformable screen printable dielectric pastes provide electrical isolation where conductive traces cross in multilayer designs. Cost-effective isolation with high breakdown voltage is achieved with a minimum of two printed dielectric layers, avoiding shunt resistance between traces.
Can In-Mold Electronics inks be customised?
Yes. Because IME applications vary widely in thermoformed geometry, graphic inks, molding conditions, and print processes, Dycotec Materials works in partnership with customers to customise formulations where needed and ensure swift adoption into high-volume production.
How can I purchase In-Mold Electronics inks?
Materials can be purchased from small samples through to bulk quantities and many products in sample quantity can be purchased online. Dycotec technical experts are available to discuss application requirements and advise on the most suitable IME material set.
Technical Support and Process Development
Dycotec Materials provides technical support and process development services to help customers optimise In-Mold Electronics materials for real-world manufacturing environments.
- Thermoforming and overmolding compatibility trials
- Pilot-scale manufacturing trials
- Four-point probe conductivity testing
- 3D optical profilometry
- Adhesion analysis
- Accelerated environmental testing
- Print process optimisation
By combining materials development with industrial-scale printing and molding expertise, we help accelerate the transition from concept to production while reducing technical risk during scale-up.
Why Choose Dycotec Materials
Choose Dycotec Materials because of our combination of materials expertise, manufacturing experience, and technical support capabilities. Our team supports projects from initial feasibility studies and prototype development through to commercial production, helping customers optimise both material performance and manufacturing processes.
Experience across automotive electronics, aerospace, domestic appliances, sensors, and flexible electronics allows us to provide practical guidance based on real-world manufacturing challenges and application requirements.
Need Help Selecting an In-Mold Electronics Ink?
Our technical team can recommend the most suitable In-Mold Electronics conductive paste, dielectric, adhesive, or encapsulant based on your application, substrate, molding process, and performance requirements.
Contact Dycotec Materials or Ask a Question for technical guidance, formulation support, or sample requests.