Thermal Interface Materials for Power Electronics, EV Batteries & High Performance Computing
View our Thermal Interface Materials products...
Dycotec Materials has developed and manufactures advanced thermal interface pastes and adhesives that deliver high thermal conductivity and long-term stability for demanding electronic applications. Designed for use in power devices, EV systems, and high-performance computing, our TIMs reduce thermal resistance between components and heatsinks, improving device reliability and efficiency. These materials are suitable for both automated and manual application and can be tailored for specific gap sizes and curing conditions.
| Name | Description | Applications | Key Features | Deposition Method | Substrates | Processing Temperature (°C) | Datasheet | hf:tax:pa_applications | hf:tax:pa_deposition-method | hf:tax:pa_substrate |
|---|---|---|---|---|---|---|---|---|---|---|
| DM-TIM-15203S | Screen and stencil printable phase change material (PCM) thermal paste delivering 1.75 W/m·K, the printable option where dispensing is impractical. A PCM additive softens at approximately 55 °C in service, flowing to fill interface voids and displace trapped air for low thermal interface resistance between power devices and heat sinks, heat spreaders, or heat pipes. Prints on aluminium heat sinks, PCB, and semiconductor device surfaces. | Lighting, Semiconductor | 1.75 W/m·K | Screen, Stencil | Aluminium heat sinks, PCB, Semiconductor device surfaces | 125, 80, Not Required |  | lighting semiconductor | screen stencil | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15025-SYP | 2.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, and the silicone-free chemistry eliminates the oil leach and migration that can contaminate optical and electrical surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 2.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15025-SY | 2.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, and the silicone-free chemistry eliminates the oil leach and migration that can contaminate optical and electrical surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 2.5 W/m·K, 30cc Syringe | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15035-SYP | 3.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration onto sensitive surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 3.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15035-SY | 3.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration onto sensitive surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 3.5 W/m·K, 30cc Syringe, 50cc Syringe | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15045-SYP | 4.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 4.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15045-SY | 4.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 4.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15055-SYP | 5.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in higher heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 5.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15055-SY | 5.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in higher heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 5.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15065-SY | 6.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in high heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 6.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15065-SYP | 6.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in high heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 6.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15204S | Screen and stencil printable phase change material (PCM) thermal paste delivering 3.3 W/m·K, compared with 1.75 W/m·K for DM-TIM-15203S. A PCM additive softens at approximately 55 °C in service, flowing to fill interface voids and displace trapped air for low thermal interface resistance between power devices and heat sinks, heat spreaders, or heat pipes. Prints on aluminium heat sinks, PCB, and semiconductor device surfaces. | Lighting, Semiconductor | 3.3 W/m·K | Screen, Stencil | Aluminium heat sinks, PCB, Semiconductor device surfaces | 125, 80, Not Required | | lighting semiconductor | screen stencil | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15323-SYP | Single-part thermally conductive epoxy adhesive delivering 2.3 W/m·K in manual syringe format for prototyping and low-volume assembly. Bonds and conducts heat simultaneously while providing high voltage isolation, removing the need for separate mechanical fixings and thermal pads. Cures at 150 °C on heat sinks, LEDs, and semiconductor device surfaces. | Lighting, Semiconductor | 10cc Syringe, 2.3 W/m·K | Manual Syringe | Heat sinks, LEDs, Semiconductor device surfaces | 150 | | lighting semiconductor | manual-syringe | heat-sinks leds semiconductor-device-surfaces |
| DM-TIM-15075-SYP | 7.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Suited to demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 7.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15075-SY | 7.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Suited to demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 7.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15323-P | Bulk packaging format of the DM-TIM-15323 single-part thermally conductive epoxy adhesive (2.3 W/m·K), supplied for customer-specified dispensing equipment and production-scale assembly. Bonds and conducts heat simultaneously while providing high voltage isolation, removing the need for separate mechanical fixings and thermal pads. Cures at 150 °C on heat sinks, LEDs, and semiconductor device surfaces. | Lighting, Semiconductor | 2.3 W/m·K | Customer dependent | Heat sinks, LEDs, Semiconductor device surfaces | 150 | | lighting semiconductor | customer-dependent | heat-sinks leds semiconductor-device-surfaces |
| DM-TIM-15085-SYP | High thermal conductivity 8.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. For the most demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 8.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15340-SYP | High thermal conductivity 3.7 W/m·K single-part epoxy adhesive in manual syringe format. Bonds and conducts heat simultaneously while providing high voltage isolation, removing the need for separate mechanical fixings and thermal pads. Cures at 150 °C on heat sinks, LEDs, and semiconductor device surfaces. | Lighting, Semiconductor | 10cc Syringe, 3.7 W/m·K | Manual Syringe | Heat sinks, LEDs, Semiconductor device surfaces | 150 | | lighting semiconductor | manual-syringe | heat-sinks leds semiconductor-device-surfaces |
| DM-TIM-15085-SY | High thermal conductivity 8.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. For the most demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 8.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
Our range of thermal interface material products are sold globally via international distributors such as DigiKey or can be purchased online, with shipping typically within 5 working days.
In addition to our standard range of thermal interface materials, we also offer customised formulation development. We have extensive facilities for development, testing and mass production of thermal interface materials to ensure high levels of reliability, particularly at high operating temperatures.
Please contact us today to discuss your thermal interface application requirements with one of our thermal management specialists.
Benefits of our Thermal Interface Materials
- High thermal conductivity to enhance heat dissipation in high-power electronic assemblies.
- Range of thermal interface materials available including liquid gap-fillers eg gels/putties, stencil printed phase change materials and epoxy adhesives
- Excellent wetting and surface contact for reduced interfacial resistance, even on rough or uneven surfaces.
- For gel/putty systems, low thermal impedance under pressure, enabling efficient heat flow from chip to heatsink.
- Stable performance over extended thermal cycling and ageing conditions.
- Screen-printable, stencil-printable, and compatible with automated syringe dispensing for seamless integration into production lines.
- Non-silicone, electrically insulating, or electrically conductive variants available.
Tailored thermal interface materials to suit different application methods and device requirements.
