Non-Silicone Thermal Gap Filler Gels & Putties for Electronics Cooling
View our Non-Silicone Gels-Putties products...
Dycotec develop and manufacture a range of thermal interface materials, that are electrically insulative, including non-silicone gels/putty liquid gap fillers. Non silicone means no pump-out and migration and outgassing which is essential for silicone-sensitive applications. Applications for these materials include power management devices, microprocessor to heat sink, batteries, LED, solar cell and lighting.
| Name | Description | Applications | Key Features | Deposition Method | Substrates | Processing Temperature (°C) | Datasheet | hf:tax:pa_applications | hf:tax:pa_deposition-method | hf:tax:pa_substrate |
|---|---|---|---|---|---|---|---|---|---|---|
| DM-TIM-15025-SYP | 2.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, and the silicone-free chemistry eliminates the oil leach and migration that can contaminate optical and electrical surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 2.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required |  | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15025-SY | 2.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, and the silicone-free chemistry eliminates the oil leach and migration that can contaminate optical and electrical surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 2.5 W/m·K, 30cc Syringe | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15035-SYP | 3.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration onto sensitive surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 3.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15035-SY | 3.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration onto sensitive surfaces. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 3.5 W/m·K, 30cc Syringe, 50cc Syringe | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15045-SYP | 4.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 4.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15045-SY | 4.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used between power devices, batteries, and LED assemblies and their heat sinks, on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 4.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15055-SYP | 5.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in higher heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 5.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15055-SY | 5.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in higher heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 5.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15065-SY | 6.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in high heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 6.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15065-SYP | 6.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Used in high heat flux power device, battery, and LED assemblies on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 6.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15075-SYP | 7.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Suited to demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 7.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15075-SY | 7.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. Suited to demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 7.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15085-SYP | High thermal conductivity 8.5 W/m·K non-silicone thermal gap filler in manual syringe format for prototyping and low-volume assembly. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. For the most demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 10cc Syringe, 8.5 W/m·K | Manual Syringe | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | manual-syringe | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15085-SY | High thermal conductivity 8.5 W/m·K non-silicone thermal gap filler in pressure-time dispense format for automated dispensing lines. Requires no cure or dry step, with silicone-free chemistry that avoids oil leach and migration. For the most demanding power electronics, electric vehicle battery, and high-performance computing thermal paths on aluminium heat sinks, PCB, and semiconductor device surfaces. | Battery, Lighting, Semiconductor | 30cc Syringe, 8.5 W/m·K | Pressure-Time Dispense | Aluminium heat sinks, PCB, Semiconductor device surfaces | Not Required | | battery lighting semiconductor | pressure-time-dispense | aluminium-heat-sinks pcb semiconductor-device-surfaces |
The materials are readily dispensed using pressure-time automation equipment and easily conform to gaps between heat sources and heat sinks. The materials remain compliant even at high operating temperatures, providing stress relief whilst maintaining excellent contact resistance.
Thermal conductivities of these systems range from 2.5 – 8.5 W/m·K
We have particular expertise in developing non-silicone thermal interface materials. Our range of thermal interface material products are sold globally via International distribution such as DigiKey or can be purchased online, with shipping typically within 5 days.
In addition to our standard range of thermal interface materials, we also offer customised formulation development. We have extensive facilities for development, testing and mass production of thermal interface materials to ensure high levels of reliability, particularly at high operating temperatures with-out materials hardening, drying or showing leaching due to device pump-out.
Please contact us today to discuss your thermal interface application requirements with one of our thermal management specialists.
Benefits of our Non-Silicone Gels and Putties:
- Range of thermal conductivities available from 2.5 – 8.5 W/m·K
- Non-silicone (no migration, leach-out, or contamination)
- Excellent stability for devices operating at high temperatures
- No cure
- Tacky/thixotropic paste
We can supply materials very rapidly, with typical shipping times within 5- 10 days. We can supply thermal interface materials in most packaging types and offer volumes from sample to high-volume material supply.
