Phase Change Thermal Interface Materials for Heat Sink Assembly
View our Phase Change Materials products...
Dycotec develop and manufacture a range of thermal interface materials, that are electrically insulative, including phase change materials. These materials flow when heat and pressure are applied to form thin bond-line structures where materials flow into voids minimising thermal contact resistance. Applications for these materials include power management modules, power transistors and lighting.
| Name | Description | Applications | Key Features | Deposition Method | Substrates | Processing Temperature (°C) | Datasheet | hf:tax:pa_applications | hf:tax:pa_deposition-method | hf:tax:pa_substrate |
|---|---|---|---|---|---|---|---|---|---|---|
| DM-TIM-15203S | Screen and stencil printable phase change material (PCM) thermal paste delivering 1.75 W/m·K, the printable option where dispensing is impractical. A PCM additive softens at approximately 55 °C in service, flowing to fill interface voids and displace trapped air for low thermal interface resistance between power devices and heat sinks, heat spreaders, or heat pipes. Prints on aluminium heat sinks, PCB, and semiconductor device surfaces. | Lighting, Semiconductor | 1.75 W/m·K | Screen, Stencil | Aluminium heat sinks, PCB, Semiconductor device surfaces | 125, 80, Not Required |  | lighting semiconductor | screen stencil | aluminium-heat-sinks pcb semiconductor-device-surfaces |
| DM-TIM-15204S | Screen and stencil printable phase change material (PCM) thermal paste delivering 3.3 W/m·K, compared with 1.75 W/m·K for DM-TIM-15203S. A PCM additive softens at approximately 55 °C in service, flowing to fill interface voids and displace trapped air for low thermal interface resistance between power devices and heat sinks, heat spreaders, or heat pipes. Prints on aluminium heat sinks, PCB, and semiconductor device surfaces. | Lighting, Semiconductor | 3.3 W/m·K | Screen, Stencil | Aluminium heat sinks, PCB, Semiconductor device surfaces | 125, 80, Not Required | | lighting semiconductor | screen stencil | aluminium-heat-sinks pcb semiconductor-device-surfaces |
They materials are readily dispensed using stencil printing automation equipment. Please contact Dycotec Materials for application notes on recommended process conditions.
Thermal conductivities of these systems range from 1.75 – 3.3 W/m·K
Materials are provided in 250g or 1 Kg so can be easily handled by operators when applying materials to stencil printing equipment.
In addition to our standard range of thermal interface materials, we also offer customised formulation development. We have extensive facilities for development, testing and mass production of thermal interface materials to ensure high levels of reliability particularly at high operating temperatures with-out materials hardening.
Please contact us today to discuss your thermal interface application requirements with one of our thermal management specialists.
Benefits of our Thermal Interface Phase Change Materials:
- Range of thermal conductivities available form 1.7 – 3.3 W/m·K
- Non-silicone (no migration, leach-out or contamination)
- Use of PCM additives provides excellent thermal transfer at interface by removal of air filled voids
- Electrically insulative
- Excellent thermal conductivity (up to 3.3 W/m·K)
- Excellent durability (150°C, bake test)
- Stencil/screen printed enabling reduced bond-line thickness (<75µm)
We can supply materials very rapidly, with typical shipping times within 5 days. We can supply thermal interface materials in most packaging types and offer volumes from sample to high volume material supply.
