Thick Film Pastes: Silver, Gold, Platinum & Resistor for Hybrid Electronics

General-purpose solderable silver cermet paste for screen printing conductor tracks and terminations for chip resistors, potentiometers, and heaters. Its wide firing window centred on 850 °C gives a smooth, dense layer on alumina, glass, dielectric-coated steel, and other ceramics, with excellent electrical conductivity. Mixed bonded system.

Insulating dielectric paste engineered specifically for ferritic 430 stainless steel, forming the base insulation layer for printed heaters and circuits on steel. Fires at 850 °C in an air oxidising atmosphere to a dense layer with excellent breakdown voltage. Screen printed.

Low-fire solderable silver cermet paste for screen printing conductors on heat-limited substrates: float glass, enamel coatings, and ceramics. Fires at 525–700 °C, well below standard 850 °C cermet systems, with good adhesion across its wide firing window. Mixed bonded system.

Silver/platinum (1%) solderable cermet paste for screen printing terminations for chip resistors, potentiometers, and heaters. The 1% platinum addition provides solder leach resistance beyond pure silver at lower cost than higher-platinum grades. Fires at 850 °C on alumina, glass, Porcelain Enamel Steel (PES), and other ceramics.

Silver/platinum (2%) solderable cermet paste for screen printing terminations for chip resistors, potentiometers, and heaters. The 2% platinum content balances solder leach resistance against cost, the mid-point of the Ag/Pt range. Fires at 850 °C on alumina, glass, Porcelain Enamel Steel (PES), and other ceramics.

Silver/platinum (3%) solderable cermet paste for screen printing terminations for chip resistors, potentiometers, and heaters. The 3% platinum content gives strong solder leach resistance for repeated soldering operations and demanding assembly. Fires at 850 °C on alumina, glass, Porcelain Enamel Steel (PES), and other ceramics.

Insulating dielectric paste engineered specifically for austenitic 304 stainless steel, forming the base insulation layer for printed heaters and circuits on steel. Fires at 850 °C in an air oxidising atmosphere to a dense layer with excellent breakdown voltage. Screen printed; matched to 304’s thermal expansion where the 430-grade DM-INS-14100 is not suitable.

Cost-effective silver resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 100 mΩ/□ at 20 µm fired thickness with a TCR of 3300 ppm/°C, useful where resistance rise with temperature aids self-regulation. Fires at 850 °C.

Silver/platinum (<2.0%) resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 100 mΩ/□ at 20 µm fired thickness with a reduced TCR of 2000 ppm/°C for more stable resistance across operating temperature than pure silver systems. Fires at 850 °C.

Silver/palladium solderable cermet paste for screen printing terminations for chip resistors, potentiometers, and heaters. Palladium addition provides solder leach resistance for repeated assembly operations. Fires at 850 °C with a smooth, dense layer on alumina, glass, Porcelain Enamel Steel (PES), and other ceramics.

Higher-resistance silver/platinum (<1.8%) resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 200 mΩ/□ at 20 µm fired thickness with a TCR of 2000 ppm/°C, suited to heater designs needing higher element resistance in shorter track lengths. Fires at 850 °C.

Low-TCR silver/platinum (2.0%) resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 200 mΩ/□ at 20 µm fired thickness with a TCR of 1500 ppm/°C, the most temperature-stable Ag/Pt grade, for heaters requiring consistent power output across their operating range. Fires at 850 °C.

Blue thermoset polymer overcoat for screen printing protective layers, solder dams, and marking over thick film resistor and conductor circuits. The blue colour provides visual contrast for inspection and marking, and the paste is solderable for downstream assembly. Prints on ceramic, stainless steel, and PCB; cures at 150–250 °C. Other colours available on request.

Silver/palladium (2.0%) resistor paste for screen printing heating elements on ceramics and dielectric-coated steel. Delivers 100 mΩ/□ at 20 µm fired thickness with a low TCR of 1500 ppm/°C, combining standard element resistance with strong temperature stability. Fires at 850 °C.

Multilayer dielectric paste for screen printing crossover and interlayer insulation in hybrid circuits on alumina. Fires at 850 °C to a non-porous, dense layer, and is compatible with Dycotec silver and gold conductor pastes for multilayer circuit stacks. REACH compliant.

White thermoset polymer overcoat for screen printing protective layers, solder dams, and marking over thick film resistor and conductor circuits. The white colour gives high-contrast legend and marking legibility, and the paste is solderable for downstream assembly. Prints on ceramic, FR4, stainless steel, and PCB; cures at 150–250 °C