Dycotec DM-ADH-11001S is a screen printable epoxy adhesive that is used for general printed electronics applications. The paste is also compatible with syringe application.

£100.00£400.00

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For organisations based in the Far East, please contact iCreate to purchase this material

Product Description

Our adhesive pastes are solvent free epoxy systems for use in general printed electronics applications.

Product Benefits

  • Screen print or syringe deposition
  • Good adhesion (>8 Kg/cm2)
  • Solvent free system
  • Single part system
  • Use on a range of substrates including PET and glass

 

Paste Preparation

The paste can be cured typically using a convection oven. Typical curing parameters used are pre-cure of the printed parts for 15 mins at 110˚C. Assemble the pre-cured parts for final cure to create adhesion between the layers. Continue the curing at 120 for 30 mins followed by post curing at 140˚C for 30 – 60 mins. Curing times may be optimised to achieve the desired adhesion depending on manufacturing process set-up.

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

4-10

Solids Content (%)

100%

Solvent Concentration

None

Screen

13 μm emulsion, 325 DPI

Flood Speed

50 mm/s

Print Speed

50 mm/s

Squeegee Hardness

80A Durometer Shore

Squeegee Pressure

5 Kg

Squeegee Angle

45o

Cured Thickness

10-15µm

Print Gap

0.5 mm

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

120-140oC

Cure Time (mins)

30 mins

Hardness

6H

Pull Strength (ASTMD4541-02)

>8 Kg/cm2

WeightN/A

Still Unsure?

Development

We provide tailored adhesive formulations.  We have experience in both epoxy and polyurethane systems.

Applications

  • Heaters
  • Sensors
  • Fuel cells
  • General printed electronics