Dycotec DM-ADH-11001S is a screen printable epoxy adhesive that is used for general printed electronics applications. The paste is also compatible with syringe application.

£100.00£400.00

p

Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing

Clear
Availability: usually ships within 5 days
In Stock

For organisations based in the Far East, please contact iCreate to purchase this material

DM-ADH-11001

Description

Product Description

Our adhesive pastes are solvent free epoxy systems for use in general printed electronics applications.

Product Benefits

  • Screen print or syringe deposition
  • Good adhesion (>8 Kg/cm2)
  • Solvent free system
  • Single part system
  • Use on a range of substrates including PET and glass

 

Paste Preparation

The paste can be cured typically using a convection oven. Typical curing parameters used are pre-cure of the printed parts for 15 mins at 110˚C. Assemble the pre-cured parts for final cure to create adhesion between the layers. Continue the curing at 120 for 30 mins followed by post curing at 140˚C for 30 – 60 mins. Curing times may be optimised to achieve the desired adhesion depending on manufacturing process set-up.

Additional information

More
Size (g)

100g, 1Kg, 250g

Viscosity after mixing (Pa.s)

4-10

Solids Content (%)

100%

Solvent Concentration

None

Screen

13 μm emulsion, 325 DPI

Flood Speed

50 mm/s

Print Speed

50 mm/s

Squeegee Hardness

80A Durometer Shore

Squeegee Pressure

5 Kg

Squeegee Angle

45o

Cured Thickness

10-15µm

Print Gap

0.5 mm

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

120-140oC

Cure Time (mins)

30 mins

Hardness

6H

Pull Strength (ASTMD4541-02)

>8 Kg/cm2

Still Unsure?

Development

We provide tailored adhesive formulations.  We have experience in both epoxy and polyurethane systems.

Applications

  • Heaters
  • Sensors
  • Fuel cells
  • General printed electronics