DM-CAP-1060 is a screen printable carbon paste that is used in IME applications such as lighting, sensors, display, heating, capacitive touchscreen and antenna devices.

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Product Description

Dycotec Materials DM-CAP-1060S is a screen printable carbon paste that is used in stretchable applications including In Mold Electronics (IME) and wearable applications. For flat bed screen printing using either manual or automatic equipment.

Product Benefits

  • Low temperature curing temperature (80-140˚C)
  • Stretchable and compatible with a wide variety of substrates
  • Excellent electrical conductivity (<22 Ω/ /25µm )
  • Compatible with Dycotec Materials IME conductive pastes (DM-SIP-1005)

Paste Preparation

DM-CAP-1060S is a thermoplastic carbon paste system. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container. The paste should be gently stirred before use avoiding incorporation of air bubbles.

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

5-10

Thinner

For slight adjustments, use DM-CAP-1060S-DT

Coverage

105 cm2/g at 10 µm

Solids Content (%)

27 – 33 %

Substrate

TPU, PC, PET

Screen

325 SS, 13 μm emulsion

Print Speed

70 mm/s

Squeegee Hardness

80A Durometer Shore

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

80 – 140oC

Cure Time (mins)

5 – 30 mins

Drying Time (mins)

15 mins

Drying Temperature (oC)

60-80oC

Sheet Resistance

<22 Ω/sqr/25µm (140˚C)

Adhesion

5B ASTM D3359

Weight 0.4 kg

Still Unsure?

Development

We offer a tailored formulation development service to meet specific customer requirements for stretchable inks this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Varying levels of stretchability versus electrical conductivity
  • Chemical compatibility
  • High resolution structures

Applications

  • In Mold Electronics (IME)
  • Sensors
  • Antenna
  • Lighting
  • Display
  • Heating
  • Capacitive touchscreen