CAP-4001-SP is a 2-part screen printable carbon paste for use in long life, high reliability applications such as resistive contact sensor and printed resistors.

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DM-CAP-4001S

Description

Product Description

CAP-4001-SP is a 2- part screen printable carbon paste for use in long life, high reliability and resistive contact sensor and printed resistor applications. The resistive paste is designed for use on PCB substrates and cures at temperatures of 200 deg. C.

Product Benefits

  • Good Printability
  • Can be mixed with other products in the CAP-4000-SP range to produce accurately controlled resistance values
  • High Abrasion Resistance
  • Excellent adhesion
  • Good screen residence time
  • Good chemical resistance

Paste Preparation

CAP-4001-SP is a 2 part paste system. It requires mixing of the Part B, CAP-4001-SP-B and the Part A, CAP-4001-SP-A in the correct ratios to form the CAP-4001-SP paste. The contents of one container of the Part B, CAP-4001-SP-B system must be added completely to a pot of CAP-4001-SP-A. The combined pastes should then be mixed slowly. Avoid rapid stirring to prevent air entrapment during the stirring process. As soon as the product is activated, the material should be used immediately. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container.

Additional information

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Viscosity after mixing (Pa.s)

10-30

Thinner

CAP-4000-DT

Substrate

FR4/PCB

Screen

13 μm emulsion, 325 DPI

Flood Speed

30 mm/s

Print Speed

45 mm/s

Squeegee Hardness

50A Durometer Shore

Squeegee Pressure

7 Kg

Squeegee Angle

45o

Cured Thickness

~ 18 μm

Print Gap

0.2 mm

Number of Strokes

2

Adhesion

5B ASTM D3359

Hardness

9H ASTM D3363, ISO 151843

Surface Roughness (Ra)

<1 μm

Sheet Resistance

100 Ω

Thickness

~18 – 25 μm

Size (g)

100g, 250g, 1Kg

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for carbon pastes this may include:
  • Specific electrical conductivities between 10-10,000 Ω/□/25µm (see typical blending curve)
  • Carbon pastes for particular substrates
  • Thermoset and thermoplastic products
  • Curing Temperatures, including temperatures <100 deg. C
  • Different deposition techniques such as syringe, spray or commonly used printing techniques

Applications

  • Potentiometer
  • Printed resistors
  • Printed Circuit Board
.