DM-CUP-5054 copper paste is designed for rotary and flat-bed screen printing for versatile use in electronic applications. The paste is designed to be rapidly cured using Xenon flash and laser systems.

£216.50£742.10

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DM-CUP-5054

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

20-40 Pa.s at 25oC

Thinner

For slight adjustments in viscosity use DM-CUP-5054-DT

Coverage

160 cm2/g at 10µm print thickness

Solids Content (%)

80-85%

Substrate

Glass, Paper, Polyimide

Screen

13 μm emulsion, 325 DPI

Flood Speed

30-70 mm/s

Print Speed

30-70 mm/s

Squeegee Hardness

80A Durometer Shore

Sintering Technique

Laser or Flash Lamp

Drying Time (mins)

20 mins

Thickness

15µm

Sheet Resistance

18 mΩ/□/25µm (polyimide)

Adhesion

4B

Line Resolution

100/125µm (L/S)

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for copper ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Chemical compatibility
  • High resolution structures

Applications

  • Touch screen
  • Printed Circuit Board
  • Sensors
  • General printed electronics