DM-CUP-5056 copper paste is designed for flat-bed screen printing for versatile use in electronic applications. The paste is designed to be rapidly cured using reducing gas atmospheres such as formic acid at temperatures as low as 120oC.

£234.50£803.90

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DM-CUP-5056

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

5-10

Thinner

For slight adjustments in viscosity use DM-CUP-5056-DT

Coverage

170-175 cm2/g at 10µm print thickness

Solids Content (%)

84-86%

Density

4.15 g/cm3

Substrate

Glass, Metal, PET, Polyimide

Screen

13 μm emulsion, 325 DPI

Flood Speed

30-70 mm/s

Print Speed

30-70 mm/s

Squeegee Hardness

80A Durometer Shore

Cured Thickness

8-12 µm

Cure Process

Reducing gas atmosphere eg formic acid

Cure Temperature (oC)

140oC

Cure Time (mins)

20 mins

Sheet Resistance

10 mΩ/□/25µm at 140oC, <5 mΩ/□/25µm at 200oC

Adhesion

5B

Hardness

4-5H

Volume Resistivity

<26 µΩ.cm at 140oC

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for copper ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Chemical compatibility
  • High resolution structures

Applications

  • Touch screen
  • Printed Circuit Board
  • Semiconductor
  • Sensors
  • General printed electronics