DM-CUP-5080 nanocopper paste is designed for manual and automatic flat-bed screen printing for versatile use in electronic applications. The paste is designed to be low temperature cured in reducing gas atmospheres such as formic acid.


Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing

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Dycotec Materials offer a range of copper pastes and inks that have been developed for a broad range of applications including; biomedical sensors, automotive, electrodes, aerospace, touch-screens and thin-film photovoltaic. Our copper pastes use ultrafine and nanomaterial powders enabling excellent electrical conductivities to be achieved whilst providing a cost effective solution. Our copper pastes are primarily designed for flat-bed and rotary screen printing but can be readily modified to suit other deposition techniques. We also provide nanocopper based inkjet systems, that can be sintered using flash lamp or laser systems.

We provide our copper pastes and inks to a global customer base, offering a flexible delivery service from low volume samples to high volume to meet our customer’s production needs. We can rapidly tailor formulations for specific customer requirements.

Additional information

Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

15-25 Pa.s at 25oC


For slight adjustments in viscosity use DM-CUP-5080-DT


192 cm2/g at 10µm

Solids Content (%)



Glass, PET, Polyimide


13 μm emulsion, 325 DPI

Flood Speed

30-80 mm/s

Print Speed

30-80 mm/s

Squeegee Hardness

70 Shore

Cure Process

Reducing gas atmosphere eg formic acid

Cure Temperature (oC)


Cure Time (mins)

20 mins

Screen Residence Time

>2.5 hrs


4-5 µm


5B ASTM D3359

Line Resolution

100 µm

Volume Resistivity

<12 µΩ.cm (200˚C), <17 µΩ.cm(140˚C), <40µΩ.cm(120˚C)

Damp Heat Test (85oC/85%RH)

Requires encapsulant, please contact sales representative

Still Unsure?


We offer a tailored formulation development service to meet specific customer requirements for copper ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Chemical compatibility
  • High resolution structures


  • Touch screen
  • Printed Circuit Board
  • Sensors
  • Semiconductor
  • General printed electronics