DM-CUP-5100 nanocopper paste is designed for rotary and flat-bed screen printing for versatile use in electronic applications. The paste is designed to be rapidly cured using Xenon flash and laser systems.

£322.60£1,613.00

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DM-CUP-5100

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Size (g)

100g, 1Kg, 250g

Viscosity after mixing (Pa.s)

5-10

Thinner

For slight adjustments in viscosity use DM-CUP-5100-DT

Coverage

420 cm2/g at 5µm

Solids Content (%)

76-80%

Substrate

Polyimide

Screen

460 PET mesh, 3 µm emulsion

Print Speed

25 mm/s

Squeegee Hardness

80A Durometer Shore

Sintering Technique

Laser or Flash Lamp

Thickness

4-5 µm

Sheet Resistance

<12 mΩ/□/25µm

Adhesion

4B

Line Resolution

100 µm

Volume Resistivity

<20 µΩ.cm

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for copper ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Chemical compatibility
  • High resolution structures

Applications

  • Touch screen
  • Printed Circuit Board
  • Sensors
  • General printed electronics