DM-GRA-9100S is a graphene-carbon hybrid paste for applications such as sensors, heaters and printed resistors that can be processed at low temperature.

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DM-GRA-9100S

Description

Product Description

DM-GRA-9100S is a single part screen printable carbon-graphene hybrid paste for general electronic application use. The paste should be cured at >140˚C for 30-60 mins to achieve a sheet resistance of <20 Ω/□‪/25µm. Tailored pastes can also be provided at increased sheet resistance up to 2,000 Ω/‪□/25µm.

Product Benefits

  • Good printability
  • Low temperature curing
  • Good screen residence time  
  • Compatibility with low temperature substrates such as PET

Paste Preparation

The paste is a single part system. Gently stir before use. Avoid rapid stirring to prevent air entrapment during the stirring process. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the original container.

Additional information

Uncured Properties
Viscosity after mixing (Pa.s)

2.5-6.5

Thinner

For slight adjustments in viscosity, please use DM-GRA-9100-DT

Coverage

350 cm2/g

Processing Conditions
Substrate

FR4, Glass, PET

Screen

13 μm emulsion, 325 DPI

Flood Speed

50 mm/s

Print Speed

70 mm/s

Squeegee Hardness

80A Durometer Shore

Squeegee Pressure

4 Kg

Squeegee Angle

45o

Cured Thickness

10 – 12 μm

Print Gap

1 mm

Number of Strokes

1

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

>140oC

Cure Time (mins)

30 mins

Cured Properties
Sheet Resistance

<20 Ω/□‪/25µm

Adhesion

5B ASTM D3359

Hardness

H (ASTM 3363)

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Size (g)

100g, 250g, 1Kg

Weight N/A

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Development

We offer a tailored formulation development service, using graphene based materials, to meet specific customer requirements.  We have experience of developing systems for specific customer applications, with different properties including:
  • Barrier Layer
  • Sensor systems including stress/strain
  • Improved lubricity
  • Rheology changes to enable use of different deposition techniques
  • Tailored electrical conductivity

Applications

  • Stress-strain sensors with improved gauge factor
  • Barrier layers
  • Heaters
  • Printed resistors
  • General printed electronics