DM-IN-7020S is a thermoset epoxy based thermally curable screen printable insulator that offers excellent mechanical hardness for applications such as sensors and multi-layer devices.

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DM-IN-7020S

Description

Product Description

Dycotec DM-IN-7020S is a thermally cured paste for screen printing for general use as an insulating layer in electronic applications. The screen printed structures are oven cured at 140–150˚C. The high abrasion resistance provides a robust surface for further processing such as printing additional electronic layers on top of the cured insulating layer.

Product Benefits

  • Formulated for screen printing
  • Low temperature thermally cured
  • High abrasion resistance
  • Electrically insulative
  • Excellent adhesion

Ink Preparation

DM-IN-7020S is a 2-part paste system. It requires mixing of the Part B, DM-IN-7020B and the Part A, DM-IN-7020A in the correct ratios to form DM-IN-7020S. The contents of one container of the Part B, DM-IN-7020B system must be added completely to a pot of DM-IN-7020A. The combined pastes should then be mixed slowly. Avoid rapid stirring to prevent air entrapment during the stirring process. Once the product is activated, the material should be used within 24 hours. After 24 hours, quality cannot be guaranteed. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container.

Additional information

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Size (g)

100g, 1Kg, 250g

Viscosity after mixing (Pa.s)

2.5-3.5

Substrate

FR4, Glass, ITO-Glass, Plastic

Screen

13 μm emulsion, 325 DPI

Flood Speed

30 mm/s

Print Speed

45 mm/s

Squeegee Hardness

60A Durometer Shore

Squeegee Pressure

7 Kg

Squeegee Angle

45o

Cured Thickness

25-30 µm

Cure Temperature (oC)

>140oC

Cure Time (mins)

>30 mins

Adhesion

5B ASTM D3359

Hardness

5H

Volume Resistivity

3.8 x 10^14 Ω.cm

Surface Resistivity

1.9 x 10^14 Ω/□

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer overcoat requirements.  We have experience of developing systems for specific customer applications, with different properties including:
  • Barrier Layer
  • Chemical resistance
  • High temperature resistance
  • Rheology changes to enable use of different deposition techniques
  • Flexibility
  • Polyurethane, silicone and epoxy systems

Applications

  • Sensors
  • Multi-layer printed circuit board
  • Heaters