DM-SAS-10010 is a silver polyurethane based stretchable conductive adhesive that is used for wearable, In-Mold Electronics and general printed electronics applications. The paste is provided in a syringe.

£85.10£252.80

p

Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing

Clear
Availability: usually ships within 5 days

For organisations based in the Far East, please contact iCreate to purchase this material

Product Description

Dycotec DM-SAS-10010 is a silver filled polyurethane stretchable conductive adhesive used for wearables, sensors and general printed electronics applications. The paste is designed to enable stress relaxation for the component assembly joint during stretching/flexing of devices. The paste may also be used for products requiring thermoforming processes. It is a single part syringe printable ink for use on PET, textile, TPU and metal substrates.

Product Benefits

• Stretchable adhesive up to 100%
• Low temperature sintering temperature (80-140oC)
• Excellent adhesion to PET, textile, TPU and metal substrates
• Excellent electrical conductivity <20 mΩ//μm (140oC)
• Deposition using syringe enabling additive processing and reduced waste
• Fully compatible with Dycotec stretchable conductive and encapsulating pastes

Paste Preparation

DM-SAS-10010 is a polyurethane silver based ink system. The ink should be used in manual and automatic syringe deposition systems.

Additional information

More
Size (g)

10cc, 30cc, 5cc, 100g, 250g, 1Kg

Solids Content (%)

74-78%

Cure Process

Convection oven, infra red heating or hot air gun

Cure Temperature (oC)

80 – 140oC

Cure Time (mins)

30 mins

Sheet Resistance

<20 mΩ/sqr/μm (140oC)

Volume Resistivity

<1×10-4 Ω.cm (80oC), <5×10-5 Ω.cm (140oC)

Pull Strength (ASTMD4541-02)

>10 Kg/cm2 (tin plated finish)

Weight N/A

Still Unsure?

Development

We offer a tailored formulation development service to meet specific customer requirements for adhesive ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Stretchable adhesives
  • Chemical compatibility
  • High resolution structures

Applications

  • Heaters
  • Sensors
  • Wearables
  • In-Mold Electronics
  • General printed electronics