DM-SAS-10030 is a single part syringe dispensable silver conductive adhesive paste that provides excellent adhesion for applications that require assembly joint flexibility. The paste can be used on flexible low temperature substrates such as textiles, TPU and PET for applications such as wearable devices, sensors, IME (In-Mold Electronics) and medical devices. Excellent print resolution ensures the paste is well suited for fine pitch components. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that can lead to assembly joint failure.

£105.20

p

Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing

Availability: usually ships within 5 days

Product Description

DM-SAS-10030 is a single part syringe dispensable silver electrically conductive adhesive (ECA) paste that provides excellent adhesion for applications that require assembly joint flexibility. The paste can be used on flexible low temperature substrates such as textiles, TPU and PET for applications such as wearable devices, sensors, IME (In-Mold Electronics) and medical devices. Excellent print resolution ensures the paste is well suited for fine pitch components. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that can lead to assembly joint failure.

Product Benefits

• Low temperature curing temperature (120oC)
• Excellent adhesion ~50 Kg/cm2 (1206 LED)
• Excellent electrical conductivity (<250 mΩ/sqr/25μm)
• In-Mold Electronics (IME) compatible
• Flexible assembly joint minimising stress that can lead to device failure

Paste Preparation

Please allow the material to reach room temperature before use. DM-SAS-10030 is supplied as a single part, silver paste, ready to use directly from syringe. Packaging options for manual (DM-SAS-10030-SYP) and automatic dispense (DM-SAS-10030-SY) are available.

Additional information

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Size (g)

30cc

Solids Content (%)

83 – 89%

Cure Process

Convection oven, infra red heating or hot air gun

Cure Temperature (oC)

120oC

Cure Time (mins)

30 mins

Sheet Resistance

<250 mΩ/sqr/25 µm

Die Shear Strength

~50 Kg/ cm2 (1206 LED)

WeightN/A

Still Unsure?

Development

We offer a tailored formulation development service to meet specific customer requirements for adhesive ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Stretchable adhesives
  • Chemical compatibility
  • High resolution structures

Applications

  • Sensors
  • Wearables
  • Medical Devices
  • General printed electronics