DM-SAS-10030 is a screen printable flexible conductive adhesive that is used for wearable, sensors, medical devices and general printed electronics applications. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that can lead to assembly joint failure.

£297.90£1,489.30

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For organisations based in the Far East, please contact iCreate to purchase this material

Product Description

DM-SAS-10030-ST is a single part stencil/screen printable silver conductive adhesive paste that provides excellent adhesion for applications that require assembly joint flexibility. The paste can be used on flexible low temperature substrates such as textiles, TPU and PET for applications such as wearable devices, sensors and medical devices. Excellent print resolution ensures the paste is well suited for fine pitch components. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that can lead to assembly joint failure.

Product Benefits

• Low temperature curing temperature (120˚C)
• Excellent adhesion ~70 Kg/cm2 (1206 LED)
• Excellent electrical conductivity (<100 mΩ//25 µm)
• Fine line print capability (<200 µm)
• Flexible assembly joint minimising stress that can lead to device failure

Paste Preparation

Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container. The paste should be gently stirred before use avoiding incorporation of air bubbles.

Additional information

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Size (g)

100g, 250g, 1Kg

Solids Content (%)

86-91%

Cure Process

Convection oven, infra red heating or hot air gun

Cure Temperature (oC)

120oC, 80 – 140oC

Cure Time (mins)

30 mins

Sheet Resistance

<100 mΩ/ /25 µm (120˚C), <20 mΩ/sqr/μm (140oC)

Pull Strength (ASTMD4541-02)

>3.5 Kg/cm2 (tin surface)

Die Shear Strength

~70 Kg/ cm2 (1206 LED), ~50 Kg/cm2 (0402 LED)

Weight N/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for adhesive ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Stretchable adhesives
  • Chemical compatibility
  • High resolution structures

Applications

  • Sensors
  • Wearables
  • Medical Devices
  • General printed electronics