DM-SIP-14005S is a RoHS compliant mixed bonded solderable silver cermet paste. It is designed to be fired at low temperatures (525-700°C) and provides good adhesion to substrates such as float glass, enamel coatings and ceramics.

£249.40£965.40

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Product Description

DM-SIP-14005S is a RoHS compliant mixed bonded solderable silver cermet paste. It is designed to be fired at low temperatures (525-700°C) and provides good adhesion to substrates such as float glass, enamel coatings and ceramics.

Product Benefits

• Good solderability with SAC and Sn95/Ag5 solderpaste systems
• Excellent fired density on alumina
• Customised blends available proving a wide range of electrical resistance at different silver loading (%)
• RoHS compliant

Paste Preparation

Bring paste up to Clean room temperature (20-25°C) by storing in the print area at least 2 hours prior to printing. Before use, the paste should be thoroughly but gently stirred with a spatula avoiding incorporation of air bubbles. Thinning of the paste is not recommended but for slight adjustments in viscosity, DM-SIP-14005-DT may be carefully used.

Additional information

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Viscosity after mixing (Pa.s)

190 – 250 Pa.S (10 rpm, Brookfield, RV-7)

Thinner

DM-SIP-14005-DT

Substrate

96% alumina, glass, enamol

Screen

325 SS, 25 µm emulsion

Flood Speed

70 – 150 mm/s

Print Speed

70 – 150 mm/s

Squeegee Hardness

80A Durometer Shore

Cured Thickness

10-15µm

Adhesion

>35N (90o wire pull, 2 mm x 2 mm pad, SAC 305, ROL1 flux)

Sheet Resistance

<3 mΩ/sqr (for 12.5µm fired thickness)

Size (g)

100g, 250g, 1Kg

Weight N/A

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Development

We offer a tailored formulation development servcie to meet specific customer requirements for high pastes this may include:
  • Different paste systems with a range of electrical conductivity and siilver solid loading (%)
  • Dielectric systems with varying CTE and with adhesion to different substrates
  • Overglaze systems 
  • TCR systems
  • Other precious metal systems

Applications

  • Automotive
  • Industrial
  • Consumer
  • Telecommunications
  • Heaters
  • Medical Devices