DM-SIP-14022S
DM-SIP-14022S
DM-SIP-14022S is an RoHS compliant mixed bonded solderable silver/platinum (3%) cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates such as glass, Porcelain Enamel Steel (PES) and other ceramics. Typical applications include terminations for chip resistor, potentiometers and heaters. It has excellent electrical conductivity and solder leach resistance.
£478.90 – £2,223.50
Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing
Product Description
DM-SIP-14022S is an RoHS compliant mixed bonded solderable silver/platinum (3%) cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates such as glass, Porcelain Enamel Steel (PES) and other ceramics. Typical applications include terminations for chip resistor, potentiometers and heaters. It has excellent electrical conductivity and solder leach resistance.
Product Benefits
• Excellent solderability with SAC and Sn95/Ag5 solderpaste systems
• Excellent fired density on alumina
• RoHS compliant
Paste Preparation
Bring paste up to Clean room temperature (20-25°C) by storing in the print area at least 2 hours prior to printing. Before use, the paste should be thoroughly but gently stirred with a spatula avoiding incorporation of air bubbles. Thinning of the paste is not recommended but for slight adjustments in viscosity, DM-SIP-14021-DT may be carefully used.
Additional information
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Development
We offer a tailored formulation development servcie to meet specific customer requirements for high pastes this may include:- Different paste systems with a range of electrical conductivity and silver solid loading (%)
- Dielectric systems with varying CTE and with adhesion to different substrates
- Overglaze systems
- TCR systems
- Other precious metal systems
Applications
- Automotive
- Industrial
- Consumer
- Telecommunications
- Heaters
- Medical Devices
