DM-SIP-14022S is an RoHS compliant mixed bonded solderable silver/platinum (3%) cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates such as glass, Porcelain Enamel Steel (PES) and other ceramics. Typical applications include terminations for chip resistor, potentiometers and heaters. It has excellent electrical conductivity and solder leach resistance.

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Product Description

DM-SIP-14022S is an RoHS compliant mixed bonded solderable silver/platinum (3%) cermet paste. It gives a smooth dense fired layer on alumina and because of its wide firing range it can be used on other substrates such as glass, Porcelain Enamel Steel (PES) and other ceramics. Typical applications include terminations for chip resistor, potentiometers and heaters. It has excellent electrical conductivity and solder leach resistance.

Product Benefits

• Excellent solderability with SAC and Sn95/Ag5 solderpaste systems
• Excellent fired density on alumina
• RoHS compliant

Paste Preparation

Bring paste up to Clean room temperature (20-25°C) by storing in the print area at least 2 hours prior to printing. Before use, the paste should be thoroughly but gently stirred with a spatula avoiding incorporation of air bubbles. Thinning of the paste is not recommended but for slight adjustments in viscosity, DM-SIP-14021-DT may be carefully used.

Additional information

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Viscosity after mixing (Pa.s)

190 – 250 Pa.S (10 rpm, Brookfield, RV-7)

Thinner

DM-SIP-14021-DT

Substrate

96% alumina, glass, PES, ceramics, Dycotec Dielectric

Screen

325 SS, 25 µm emulsion

Flood Speed

70 – 150 mm/s

Print Speed

70 – 150 mm/s

Squeegee Hardness

60 – 80A Shore

Cured Thickness

10-15µm

Adhesion

>30N (90o wire pull, 2 mm x 2 mm pad, SAC 305, ROL1 flux)

Sheet Resistance

<8 mΩ/sqr (for 12.5µm fired thickness)

Size (g)

100g, 250g, 1Kg

Weight N/A

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Development

We offer a tailored formulation development servcie to meet specific customer requirements for high pastes this may include:
  • Different paste systems with a range of electrical conductivity and silver solid loading (%)
  • Dielectric systems with varying CTE and with adhesion to different substrates
  • Overglaze systems 
  • TCR systems
  • Other precious metal systems

Applications

  • Automotive
  • Industrial
  • Consumer
  • Telecommunications
  • Heaters
  • Medical Devices