DM-SIP-3064S is a flat-bed and rotary screen printable silver paste that is used for OPV thin film PV electrodes and general printed electronics applications. It is designed for specifically for compatibility with OPV.

£266.50£1,021.70

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Product Description

Dycotec DM-SIP-3064S is a flat-bed and rotary screen printable silver paste that is used for OPV thin film PV electrodes and general printed electronics applications. It is designed for specifically for compatibility with OPV.

Product Benefits

• Fast Drying
• Excellent adhesion
• Good electrical conductivity

Paste Preparation

DM-SIP-3064S is a single part paste system. The paste should be gently stirred before use avoiding incorporation of air bubbles. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container.

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

3-8

Thinner

For slight adjustments in viscosity use DM-SIP-3064-DT

Coverage

145 cm2/g at 10 μm cured print thickness

Solids Content (%)

72-78%

Substrate

ITO-PET, PET

Screen

13 μm emulsion, 325 DPI

Print Speed

30-80 mm/s

Squeegee Hardness

80A Durometer Shore

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

120-140oC

Cure Time (mins)

5 mins

Screen Residence Time

<30 mins

Sheet Resistance

<19 mΩ/□/25µm

Adhesion

5B ASTM D3359

Line Resolution

250 µm

Volume Resistivity

<48 μΩ.cm

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for silver ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Thermoset and thermoplastic products
  • Curing Temperatures, including temperatures <100 deg. C
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Chemical compatibility
  • High resolution structures

Applications

  • Sensors
  • Heaters
  • General printed electronics on rigid substrates