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DM-SIP-3100S

Additional information

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Size (g)

100g, 1Kg, 250g

Viscosity after mixing (Pa.s)

2-4

Thinner

For slight adjustments in viscosity, use DM-SIP-3100-DT

Coverage

290 cm2/g

Solids Content (%)

56-62%

Substrate

Glass, TCO-glass

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

130-140oC

Cure Time (mins)

20 mins

Sheet Resistance

<8 mΩ/□/25µm

Adhesion

5B ASTM D3359

Line Resolution

250 µm

Volume Resistivity

<20 µΩ.cm

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for silver ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Thermoset and thermoplastic products
  • Curing Temperatures, including temperatures <100 deg. C
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Chemical compatibility
  • High resolution structures

Applications

  • 3D printing
  • General printed electronics