DM-SIP-3110S is a highly electrically conductive screen printable nanosilver paste for flexible applications such as hybrid printed electronics. The paste is compatible with low temperature substrates such as PET due to its low curing temperature (100-200ºC).

£317.50£1,904.80

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Product Description

DM-SIP-3110S is a highly electrically conductive screen printable nanosilver paste for flexible applications such as hybrid printed electronics. The paste is compatible with low temperature substrates such as PET due to its low curing temperature (100-200ºC).

Product Benefits

• Excellent electrical conductivity of 3 mΩ/sqr/25µm when cured at low temperature (140°C)
• Excellent adhesion (5B) on a broad range of plastic substrates (PET, PI)
• Excellent print resolution
• Rapid sinter times (2-20 mins)
• Compatible with Dycotec dielectric, carbon and conductive adhesive systems

Paste Preparation

Bring paste up to room temperature (20-25°C) by storing in the print area at least 2 hours prior to printing. Before use, the paste should be thoroughly but gently stirred with a spatula avoiding incorporation of air bubbles. Thinning of the paste is not recommended but for slight adjustments in viscosity, DM-SIP-3110-DT may be used.

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

8 – 12

Thinner

For slight adjustments in viscosity use DM-SIP-3110-DT

Solids Content (%)

75 – 77%

Substrate

PET, Polyimide

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

100 – 200 degC

Cure Time (mins)

2 – 20 mins

Sheet Resistance

3 mΩ/sqr/25µm (140oC cure), 2 mΩ/sqr/25µm (200oC cure)

Adhesion

5B ASTM D3359

Damp Heat Test (85oC/85%RH)

No increase in sheet or contact resistance after 1000 hrs

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for silver ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Thermoset and thermoplastic products
  • Curing Temperatures, including temperatures <100 deg. C
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Chemical compatibility
  • High resolution structures

Applications

  • Hybrid printed electronics
  • Fine line circuitry
  • General printed electronics