DM-TIM-15085-SYP
DM-TIM-15085-SYP
DM-TIM-15085 is a one part, non-silicone high thermal conductivity paste (8.5 W/m.K). The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.
£45.97 – £2,837.92
Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing
Product Description
DM-TIM-15085 is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually dispensed depending on packaging option. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.
Product Benefits
• Non-silicone (no migration, leach-out or contamination)
• Excellent stability for devices operating at high temperature
• High Thermal Conductivity (8.5 W/m.K)
• No cure
• Tacky/thixotropic paste
Applications
Interface for semiconductors requiring low pressure or spring clamp mounting. Consumer electronics, Set-top boxes, IP routers, ECUs Memory and Power modules. CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, LED. TEC modules, Telecommunication hardware and as a gap filler for battery systems.
Additional information
| More | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ||||||||||||||||
| ||||||||||||||||
Still Unsure?
Development
We offer a tailored formulation development service to meet specific customer requirements for thermal interface materials this may include:- Customised mechanical properties eg conformability, bond-line thickness
- Customised thermal conductivity and thermal interface resistance
- Epoxy, silicone, acrylic and urethane systems
- Develop for range of deposition systems
- Application testing, process development and modelling at our UK R&D technology development centre
- Training
Applications
- Consumer electronics
- Set-top boxes,
- IP routers
- ECUs Memory
- Power modules eg IGBTs
- LED
- CPU to Heat sink
- Rectifiers
- Gap filler for batteries
