DM-TIM-15203S
DM-TIM-15203S
DM-15203S is a screen/stencil printed high thermal conductivity PCM (Phase Change Material) paste. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes. The paste incorporates a PCM additive that softens at ~55 deg. C to fill interface voids and cavities to provide low thermal interface resistance by elimination of air filled gaps and improving heater transfer at the interface.
£99.00 – £165.00
Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing
For organisations based in the Far East, please contact iCreate to purchase this material
Product Description
DM-15203S is a screen/stencil printed high thermal conductivity PCM (Phase Change Material) paste. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes. The paste incorporates a PCM additive that softens at ~55 deg. C to fill interface voids and cavities to provide low thermal interface resistance by elimination of air filled gaps and improving heater transfer at the interface.
Product Benefits
• Non-silicone (no migration, leach-out or contamination)
• Use of PCM additives provides excellent thermal transfer at interface by removal of air filled voids.
• High Thermal Conductivity (2.8 W/m.K)
• Excellent thermal conductivity
• Excellent durability (150oC, bake test)
• Stencil/screen printed enabling reduced bond-line thickness (<40 µm) due to small particle filler size, reworkable
Applications
Interface for semiconductors requiring low pressure or spring clamp mounting. Consumer electronics, Set-top boxes, IP routers, ECUs Memory and Power modules. CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, LED. TEC modules, Telecommunication hardware and as a gap filler for battery systems.
Additional information
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Still Unsure?
Development
We offer a tailored formulation development service to meet specific customer requirements for thermal paste and sheets including:- Tailored thermal conductivity
- Modification of material systems to ensure compatibility with customer production processes eg screen/stencil, syringe dispense
- Modification of mechanical properties eg compressibility
- Substrate wetting and adhesion
- Sheet thickness
- Non-silicone, thermoset, silicone, theromoplastic systems available
Applications
- Consumer electronics such as smart devices
- General electronics/semiconductor eg IGBT
- Automotive: EV, sensors, lighting
- LED lighting
- Clean Energy such as PV, wind turbine
