DM-15203S is a screen/stencil printed high thermal conductivity PCM (Phase Change Material) paste. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes. The paste incorporates a PCM additive that softens at ~55 deg. C to fill interface voids and cavities to provide low thermal interface resistance by elimination of air filled gaps and improving heat transfer at the interface.

£99.00£165.00

p

Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing

Availability: usually ships within 5 days

Product Description

DM-TIM-15203 is a screen/stencil printed high thermal conductivity PCM (Phase Change Material) paste. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes. The paste incorporates a PCM additive that softens at ~55 deg. C to fill interface voids and cavities providing low thermal interface resistance by elimination of air gaps and improving heat transfer at the interface.

Product Benefits

• Non-silicone (no migration, leach-out or contamination)
• Use of PCM additives provides excellent thermal transfer at interface by removal of air filled voids.
• Electrically insulative
• Excellent thermal conductivity (1.75 W/m.K)
• Excellent durability (150oC, bake test)
• Stencil/screen printed enabling reduced bond-line thickness (<50 µm) due to small particle filler size, reworkable. Syringe packaging also available

Applications

Interface for semiconductors requiring low pressure or spring clamp mounting. Consumer electronics, Set-top boxes, IP routers, ECUs Memory and Power modules. CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, LED. TEC modules, Telecommunication hardware and as a gap filler for battery systems.

Product Use

Please download application note for best practise on use of our phase change thermal interface materials.

Additional information

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Size (g)

250g, 1Kg

Viscosity

5 – 10 Pa.S

Density

2.1 g/cm3

Colour

Grey

Minimum Bondline Thickness

<50 um

Thermal Conductivity (ASTM D5470)

1.75 W/m.K

Thermal Contact Resistance (ASTM D5470)

8.1 x 10-5 m2.K/W

Dielectric Strength (ASTM D149)

4.85 KV/mm

Volume Resistivity (ASTM D257)

>1 x 10^11 Ω.cm

Operating Temperature Range

-40 to +150 deg. C

Thermal Stability (150 deg.C, JESD22-A103)

>1000 hours

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for thermal paste and sheets including:
  • Tailored thermal conductivity
  • Modification of material systems to ensure compatibility with customer production processes eg screen/stencil, syringe dispense
  • Modification of mechanical properties eg compressibility
  • Substrate wetting and adhesion
  • Sheet thickness
  • Non-silicone, thermoset, silicone, theromoplastic systems available
Customers are welcomed to our technology centre in Calne to enable appropriate thermal interface materials to be rapidly selected and introduced into their applications.

Applications

  • Consumer electronics such as smart devices
  • General electronics/semiconductor eg IGBT
  • Automotive: EV, sensors, lighting
  • LED lighting
  • Clean Energy such as PV, wind turbine