DM-TIM-15340-SYP
DM-TIM-15340-SYP
DM-TIM-15340 is a high thermal conductivity (3.7 W/m.K) single part epoxy adhesive. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes whilst ensuring high voltage isolation. The material acts as both a thermal interface material and an adhesive reducing the amount of assembly components needed in a device.
£54.07
Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing
Product Description
DM-TIM-15340 is a high thermal conductivity (3.7 W/m.K) single part epoxy adhesive. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes whilst ensuring high voltage isolation. The material acts as both a thermal interface material and an adhesive reducing the amount of assembly components needed in a device.
Product Benefits
• Excellent thermal conductivity (3.7 W/m.K)
• High bond strength
• High breakdown voltage >14 kV/mm
• Single part system
• Excellent thermal stability with high operating temperatures
• Low water absorption
Applications
• Heat sink bonding
• Potting/encapsulating sensors
• Semiconductor use eg chip-scale packages, power semiconductors
• Battery systems – modules and packs
• LED and Automotive lighting
• Power supplies
• Industrial appliances
Additional information
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Development
We offer a tailored formulation development service to meet specific customer requirements for thermal interface materials this may include:- Customised mechanical properties eg conformability, bond-line thickness
- Customised thermal conductivity and thermal interface resistance
- Epoxy, silicone, acrylic and urethane systems
- Develop for range of deposition systems
- Application testing, process development and modelling at our UK R&D technology development centre
- Training
