DM-UFL-16100 is a high purity underfill for flip chip devices for the semiconductor industry. It is designed for use with <50 µm features with high Tg to ensure compatibility with peak reflow temperatures of lead-free solders. It is a two part epoxy thermoset underfill that is typically deposited from a syringe. Materials can be supplied as either 2 part syringes or pots.

£92.00£209.20

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Product Description

DM-UFL-16100 is a high purity underfill for flip chip devices for the semiconductor industry. It is designed for use with <50 µm features with high Tg to ensure compatibility with peak reflow temperatures of lead-free solders. It is a two part epoxy thermoset underfill that is typically deposited from a syringe. Materials can be supplied as either 2 part syringes or pots.

Product Benefits

• High Tg (192˚C) providing stable performance at high operating temperatures
• Suitable for use with fine pitch components (<50 µm channels)
• 2 part epoxy system
• Good thermal conductivity (1.8 W/m.K)
• Pot-life >60 minutes

Applications

• Heat sink bonding
• Potting/encapsulating sensors
• Semiconductor use eg chip-scale packages, power semiconductors
• LED and Automotive lighting
• Power supplies
• Industrial appliances

Additional information

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Viscosity (50s-1)

1 – 5 Pa.s

Density (ASTM D792)

2.04 g/cm3

Colour

Grey

Thermal Conductivity (ASTM D5470)

1.8 W/m.K

Dielectric Strength (ASTM D149 MOD)

>15 kV/mm

Volume Resistivity (ASTM D257)

>1 x 10^14 Ω.cm

Size (cc)

100g, 250g, 1Kg

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for thermal interface materials this may include:
  • Customised mechanical properties eg conformability, bond-line thickness
  • Customised thermal conductivity and thermal interface resistance
  • Epoxy, silicone, acrylic and urethane systems
  • Develop for range of deposition systems
  • Application testing, process development and modelling at our UK R&D technology development centre
  • Training

Applications

• Heat sink bonding • Potting/encapsulating sensors • Semiconductor use eg chip-scale packages, power semiconductors • LED and Automotive lighting • Power supplies • Industrial appliances