DM-UFL-16100
DM-UFL-16100
DM-UFL-16100 is a high purity underfill for flip chip devices for the semiconductor industry. It is designed for use with <50 µm features with high Tg to ensure compatibility with peak reflow temperatures of lead-free solders. It is a two part epoxy thermoset underfill that is typically deposited from a syringe. Materials can be supplied as either 2 part syringes or pots.
£92.00 – £209.20
Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing
For organisations based in the Far East, please contact iCreate to purchase this material
Product Description
DM-UFL-16100 is a high purity underfill for flip chip devices for the semiconductor industry. It is designed for use with <50 µm features with high Tg to ensure compatibility with peak reflow temperatures of lead-free solders. It is a two part epoxy thermoset underfill that is typically deposited from a syringe. Materials can be supplied as either 2 part syringes or pots.
Product Benefits
• High Tg (192˚C) providing stable performance at high operating temperatures
• Suitable for use with fine pitch components (<50 µm channels)
• 2 part epoxy system
• Good thermal conductivity (1.8 W/m.K)
• Pot-life >60 minutes
Applications
• Heat sink bonding
• Potting/encapsulating sensors
• Semiconductor use eg chip-scale packages, power semiconductors
• LED and Automotive lighting
• Power supplies
• Industrial appliances
Additional information
| More | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
||||||||||||||
|
||||||||||||||
Still Unsure?
Development
We offer a tailored formulation development service to meet specific customer requirements for thermal interface materials this may include:- Customised mechanical properties eg conformability, bond-line thickness
- Customised thermal conductivity and thermal interface resistance
- Epoxy, silicone, acrylic and urethane systems
- Develop for range of deposition systems
- Application testing, process development and modelling at our UK R&D technology development centre
- Training
