DM-INS-1506 is a screen printable cross over dielectric paste that is used in IME applications such as lighting, sensors, display, heating, capacitive touchscreen and antenna devices.

£172.50£399.90

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Product Description

DM-INS-1506 is part of the Dycotec Materials product portfolio developed specifically for In-Mold Electronics (IME) applications. It is a solvent based screen printable insulator used to produce highly robust cross-over structures used in multilayer circuit designs. The paste is compatible with thermoforming and over-molding processes.

Product Benefits

  • Excellent insulation properties with 2 printed layers
  • Excellent printability with low pin-hole formation
  • High surface/volume resistivity
  • High stretchability with no cracking observed after thermoforming
  • In-Mold Electronics (IME) use

Paste Preparation

DM-INS-1506 is a single part paste system. The paste should be gently stirred before use avoiding incorporation of air bubbles. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container.

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

10 – 16

Thinner

for small adjustments in viscosity use DM-INS-1506-DT

Coverage

222cm2/g (10 µm thickness), 180 mesh,SS,23μm Emulsion

Solids Content (%)

58-63%

Substrate

PC

Screen

180SS, 23 μm EOM

Print Speed

100 – 400 mm/s

Squeegee Hardness

80A Durometer Shore

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

100˚C

Adhesion

5B ASTM D3359

Breakdown Voltage (ASTM D150)

>31 kV/mm

Dielectric Constant @1 KHz (ASTM D150)

3.5

Hardness (ASTM D3363)

2B

Volume Insulation Resistance

>5 x 10^13 Ω.cm

Surface Insulation Resistance

>2 x 10^13 Ω/sqr

Damp Heat Test (85OC/85%RH) for 1000 hrs

No loss in adhesion or visual changes

Weight0.4 kg

Still Unsure?

Development

We offer a tailored formulation development service to meet specific customer requirements for stretchable inks this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Varying levels of stretchability versus electrical conductivity
  • Chemical compatibility
  • High resolution structures

Applications

  • In Mold Electronics (IME)
  • Sensors
  • Antenna
  • Lighting
  • Display
  • Heating
  • Capacitive touchscreen