Dycotec DM-SIA-3301 is a nanosilver ink designed for use with the Optomec Aerosol Jet with pneumatic atomiser systems. The ink is compatible with a range of different types of substrates and can be processed anywhere between 100 to 200oC. It offers exceptional levels of electrical conductivity and adhesion.

£333.50£740.90

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Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing

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Product Description

Dycotec DM-SIA-3301 is a nanosilver ink designed for use with the Optomec Aerosol Jet with pneumatic atomiser systems. The ink is compatible with a range of different types of substrates and can be processed anywhere between 100 to 200oC. It offers exceptional levels of electrical conductivity and adhesion. .

Product Benefits

• Low temperature cure (100oC)
• Excellent electrical conductivity <6 mΩ/sqr/25 μm at 100oC and <3 mΩ/sqr/25 μm at 200oC
• Excellent adhesion (5B) on a broad range of substrates
• Developed for use with Optomec aerosol jet printing

Ink Preparation

Stir (not shake) the ink thoroughly before use to ensure the product is well mixed whilst care should be taken to avoid introducing air bubbles. Do not replace used ink in the container.

Additional information

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Size (g)

100g, 250g

Viscosity (cps)

40 – 100 cps

Solids Content (%)

60 – 65%

Substrate

PEKK, PET, Polyimide

Cure Temperature (oC)

100 – 200 degC

Cure Time (mins)

5 – 30 mins

Sheet Resistance

<6 mΩ/sqr/25 μm at 100oC and <3 mΩ/sqr/25 μm at 200oC

Volume Resistivity

<15 μΩ.cm (100oC), <8 μΩ.cm (200oC)

Adhesion

5B

WeightN/A

Still Unsure?

Development

We offer a tailored formulation development service to meet specific customer requirements for silver ink this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Thermoset and thermoplastic products
  • Curing Temperatures, including temperatures <100 deg. C
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Die attach or assembly
  • Chemical compatibility
  • High resolution structures

Applications

  • Semiconductor
  • Assembly
  • Optical communications
  • Wearables
  • General printed electronics