DM-AS-10003-SYP
DM-AS-10003-SYP
DM-AS-10003 is a single part silver epoxy conductive adhesive paste that provides excellent adhesion for applications that require assembly joint flexibility. The paste can be used on flexible low temperature substrates such as textiles, PC and PET for applications such as wearable devices, sensors and medical devices. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that can lead to assembly joint failure.
£84.10 – £490.10
Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing
For organisations based in the Far East, please contact iCreate to purchase this material
Product Description
DM-AS-10003 is a single part silver epoxy conductive adhesive paste that provides excellent adhesion for applications that require assembly joint flexibility. The paste can be used on flexible low temperature substrates such as textiles, PC and PET for applications such as wearable devices, sensors and medical devices. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that can lead to assembly joint failure.
Product Benefits
• Low temperature curing temperature (130-150˚C)
• Dispensed from syringe, available in various syringe packaging sizes
• Excellent adhesion >16 N/mm2 (copper)
• Excellent electrical conductivity (<2 x 10-4 Ω.cm)
• Flexible assembly joint minimising stress that can lead to device failure for flexible electronics
Paste Preparation
Provided in syringe for immediate use. Paste systems can also be provided in pots for syringe or screen printing, please contact info@dycotecmaterials.com for more information.
Additional information
| More | ||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||
Still Unsure?
Development
We offer a tailored formulation development service to meet specific customer requirements for adhesive ink and pastes this may include:- Specific electrical conductivities
- Development for particular substrates
- Different curing processes
- Different deposition techniques such as syringe, screen/stencil or other commonly used printing/coating techniques
- Stretchable adhesives
- Chemical compatibility
- High resolution structures
Applications
- Printed Hybrid Electronics
- Sensors
- Antenna
- Medical Devices
- Semiconductor
- General printed electronics
