DM-AS-10003 is a single part silver epoxy conductive adhesive paste that provides excellent adhesion for applications that require assembly joint flexibility. The paste can be used on flexible low temperature substrates such as textiles, PC and PET for applications such as wearable devices, sensors and medical devices. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that can lead to assembly joint failure.

£84.10£490.10

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Product Description

DM-AS-10003 is a single part silver epoxy conductive adhesive paste that provides excellent adhesion for applications that require assembly joint flexibility. The paste can be used on flexible low temperature substrates such as textiles, PC and PET for applications such as wearable devices, sensors and medical devices. The adhesive maintains flexibility when fully cured, minimising the stress concentrations that can lead to assembly joint failure.

Product Benefits

• Low temperature curing temperature (130-150˚C)
• Dispensed from syringe, available in various syringe packaging sizes
• Excellent adhesion >16 N/mm2 (copper)
• Excellent electrical conductivity (<2 x 10-4 Ω.cm)
• Flexible assembly joint minimising stress that can lead to device failure for flexible electronics

Paste Preparation

Provided in syringe for immediate use. Paste systems can also be provided in pots for syringe or screen printing, please contact info@dycotecmaterials.com for more information.

Additional information

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Size (g)

10 cc (Quantity = 1), 10 cc (Quantity = 10), 10 cc (Quantity = 5)

Viscosity (cps)

10000-15000

Density

3.82 g/mL

Conductive Filler Type

Silver

Colour

Silver-grey

Substrate

Metal, PC, PET

Deposition Method

Manual

Cure Temperature (oC)

130-150 deg.C

Cure Time (mins)

30-60 mins

Volume Resistivity

<2 x 10-4 Ω.cm

Die Shear Strength

>16 N/ mm2

Water Absorption (ASTM D570-98)

<0.7% after 24 hour immersion

Flexibility (50 cycles, bend radius 15 mm)

No increase in resistance (150˚C)

Weight Loss

0.36% (200oC), 0.62% (250oC), 1.96% (300oC)

Intermittent Maximum Operating Temp

278oC

Continuous Maximum Operating Temp

200oC

Weight N/A

Still Unsure?

Development

We offer a tailored formulation development service to meet specific customer requirements for adhesive ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, screen/stencil or other commonly used printing/coating techniques
  • Stretchable adhesives
  • Chemical compatibility
  • High resolution structures

Applications

  • Printed Hybrid Electronics
  • Sensors
  • Antenna
  • Medical Devices
  • Semiconductor
  • General printed electronics