DM-SIP-3072S is a highly electrically conductive screen printable silver paste for flexible applications such as hybrid printed electronics. The paste is compatible with low temperature substrates such as PET due to its low curing temperature (100-150ºC).

£165.20£1,399.10

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Product Description

DM-SIP-3072S is a highly electrically conductive screen printable silver paste for flexible applications such as hybrid printed electronics. The paste is compatible with low temperature substrates such as PET due to its low curing temperature (100-150ºC).

Product Benefits

• Excellent electrical conductivity of 3 mΩ/sqr/25µm when cured at low temperature (100-150°C for 10-30 min)
• Excellent adhesion (5B) on a broad range of plastic substrates (PET, PI, PEKK, PEN)
• Excellent print resolution
• Compatible with Dycotec dielectric, carbon and conductive adhesive systems

Paste Preparation

DM-SIP-3072S is supplied as a single part ready to use ink. Gently stir before use, avoiding introduction of air bubbles. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container.

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

5-10

Thinner

For slight adjustments in viscosity use DM-SIP-3072S-DT

Solids Content (%)

74-77%

Substrate

PEKK, PEN, PET, Polyimide

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

100-150 deg. C

Cure Time (mins)

1-10 mins

Sheet Resistance

3 mΩ/sqr/25µm (150oC cure), 5 mΩ/sqr/25µm (100oC cure)

Adhesion

5B ASTM D3359

Line Resolution

<250 µm depending on print set-up

Damp Heat Test (85oC/85%RH)

No increase in sheet or contact resistance after 1000 hrs

Weight N/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for silver ink and pastes this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Thermoset and thermoplastic products
  • Curing Temperatures, including temperatures <100 deg. C
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Chemical compatibility
  • High resolution structures

Applications

  • Printed Hybrid Electronics
  • Display
  • General printed electronics