DM-SIP-1006
DM-SIP-1006
DM-SIP-1006 is part of the Dycotec Materials product portfolio developed specifically for In-Mold Electronics (IME) applications. It is a solvent based screen printable conductive ink used to produce highly electrically conductive structures used in multilayer circuit designs. The paste is compatible with thermoforming processes and overmolding temperatures.
£250.20 – £1,286.60
Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing
For organisations based in the Far East, please contact iCreate to purchase this material
Product Description
DM-SIP-1006 is part of the Dycotec Materials product portfolio developed specifically for In-Mold Electronics (IME) applications. It is a solvent based screen printable conductive ink used to produce highly electrically conductive structures used in multilayer circuit designs. The paste is compatible with thermoforming processes and overmolding temperatures.
Product Benefits
- Good thermoformable characteristics for In-Mold Electronics (IME) use
- Excellent printability
- Excellent electrical conductivity (15 mΩ/sqr/25µm)
- Compatible with Dycotec Materials IME dielectric and conductive adhesive pastes
Paste Preparation
DM-SIP-1006 is a thermoplastic silver paste system. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container. The paste should be gently stirred before use avoiding incorporation of air bubbles.
Additional information
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Still Unsure?
Development
We offer a tailored formulation development service to meet specific customer requirements for stretchable inks this may include:- Specific electrical conductivities
- Development for particular substrates
- Different curing processes
- Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
- Varying levels of stretchability versus electrical conductivity
- Chemical compatibility
- High resolution structures
Applications
- In Mold Electronics (IME)
- Sensors
- Antenna
- Lighting
- Display
- Heating
- Capacitive touchscreen
