DM-SIP-1006 is part of the Dycotec Materials product portfolio developed specifically for In-Mold Electronics (IME) applications. It is a solvent based screen printable conductive ink used to produce highly electrically conductive structures used in multilayer circuit designs. The paste is compatible with thermoforming processes and overmolding temperatures.

£250.20£1,286.60

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Product Description

DM-SIP-1006 is part of the Dycotec Materials product portfolio developed specifically for In-Mold Electronics (IME) applications. It is a solvent based screen printable conductive ink used to produce highly electrically conductive structures used in multilayer circuit designs. The paste is compatible with thermoforming processes and overmolding temperatures.

Product Benefits

  • Good thermoformable characteristics for In-Mold Electronics (IME) use
  • Excellent printability
  • Excellent electrical conductivity (15 mΩ/sqr/25µm)
  • Compatible with Dycotec Materials IME dielectric and conductive adhesive pastes

Paste Preparation

DM-SIP-1006 is a thermoplastic silver paste system. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container. The paste should be gently stirred before use avoiding incorporation of air bubbles.

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

6 – 10

Thinner

DM-SIP-1006-DT

Coverage

156 cm2/g (10 µm thickness)

Solids Content (%)

65 – 70%

Substrate

PC

Screen

280 SS

Print Speed

100 – 400 mm/s

Squeegee Hardness

80A Durometer Shore

Cure Process

Convection oven or IR heating

Cure Temperature (oC)

120-130 deg.C

Cure Time (mins)

5 – 20 mins

Drying Time (mins)

15 mins

Drying Temperature (oC)

80oC

Sheet Resistance

15 mΩ/sqr/25µm

Adhesion

5B ASTM D3359

Weight 0.4 kg

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Development

We offer a tailored formulation development service to meet specific customer requirements for stretchable inks this may include:
  • Specific electrical conductivities
  • Development for particular substrates
  • Different curing processes
  • Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
  • Varying levels of stretchability versus electrical conductivity
  • Chemical compatibility
  • High resolution structures

Applications

  • In Mold Electronics (IME)
  • Sensors
  • Antenna
  • Lighting
  • Display
  • Heating
  • Capacitive touchscreen