DM-SIP-2002 is a screen printable silver paste that is used in stretchable applications such as wearable devices, sensors and medical devices. The paste can be applied to elastomeric and textile substrates.
£197.70 – £889.80
Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing
For organisations based in the Far East, please contact iCreate to purchase this material
DM-SIP-2002 is a screen printed stretchable silver conductive ink and is part of our product portfolio designed for use in stretchable/wearable applications. This ink can be applied to elastomeric substrates such as polyurethane and textiles. Our stretchable conductive inks find application in wearable technologies, stretchable stress/strain sensors, medical devices, automotive interiors, lighting and printed electronics applications. These inks are typically used in multilayer printed structures where our encapsulants and dielectric materials enable excellent durability in machine wash cycles. Component attach can also be achieved, with our stretchable inks, by using our flexible/stretchable conductive adhesives. In addition to flat bed and R2R screen printing, the inks can also be used in transfer printing processes.
- Low temperature curing temperature (80-200˚C)
- Stretchable up to 100%
- Excellent electrical conductivity (<25 mΩ/ /mil)
- Compatible with a wide variety of substrates including polyurethane, textiles and other elastomers
- Compatible with Dycotec Materials stretchable encapsulation pastes DM-ENC-2500 and DM-INS-2501
DM-SIP-2002 is a thermoplastic silver paste system. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container. The paste should be gently stirred before use avoiding incorporation of air bubbles.
DevelopmentWe offer a tailored formulation development service to meet specific customer requirements for stretchable inks this may include:
- Specific electrical conductivities
- Development for particular substrates
- Different curing processes
- Different deposition techniques such as syringe, spray or other commonly used printing/coating techniques
- Varying levels of stretchability versus electrical conductivity
- Chemical compatibility
- High resolution structures
- General printed electronics