DM-TIM-15323-SYP is a high thermal conductivity single part epoxy adhesive. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes whilst ensuring high voltage isolation. The material acts as both a thermal interface material and an adhesive reducing the amount of assembly components needed in a device.

£19.95

p

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Product Description

DM-TIM-15323-SYP is a high thermal conductivity single part epoxy adhesive. It is designed to provide superior heat transfer between a heat generating component eg power device and heat sink, heat spreader or other cooling device eg fans, heat pipes whilst ensuring high voltage isolation. The material acts as both a thermal interface material and an adhesive reducing the amount of assembly components needed in a device.

Product Benefits

• Excellent thermal conductivity (2.3 W/m.K)
• High bond strength
• High breakdown voltage >14 kV/mm
• Single part system
• Excellent thermal stability with high operating temperatures
• Low water absorption

Applications

• Heat sink bonding
• Potting/encapsulating sensors
• Semiconductor use eg chip-scale packages, power semiconductors
• Battery systems – modules and packs
• LED and Automotive lighting
• Power supplies
• Industrial appliances

Additional information

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Viscosity (50s-1)

40 – 60 Pa.s

Density (ASTM D792)

2.5 g/cm3

Colour

Grey

Thermal Conductivity (ASTM D5470)

2.3 W/m.K

Thermal Contact Resistance (ASTM D5470)

7 x 10^-5 m2.K/W

Dielectric Strength (ASTM D149 MOD)

>14 kV/mm

Volume Resistivity (ASTM D257)

>1 x 10^12 Ω.cm

Dielectric Constant (ASTM D149)

3.0 (1 KHz)

Size (cc)

10 cc (25g)

WeightN/A

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Development

We offer a tailored formulation development service to meet specific customer requirements for thermal interface materials this may include:
  • Customised mechanical properties eg conformability, bond-line thickness
  • Customised thermal conductivity and thermal interface resistance
  • Epoxy, silicone, acrylic and urethane systems
  • Develop for range of deposition systems
  • Application testing, process development and modelling at our UK R&D technology development centre
  • Training

Applications

• Heat sink bonding • Potting/encapsulating sensors • Semiconductor use eg chip-scale packages, power semiconductors • Battery systems - modules and packs • LED and Automotive lighting • Power supplies • Industrial appliances