DM-TIM-15045 is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging option. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects.

£58.53£4,544.00

p

Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing

Availability: usually ships within 5 days

Product Description

DM-TIM-15045-SY is a one part, non-silicone high thermal conductivity paste. The materials are supplied in a syringe for use on automated dispensing equipment or can be manually processed depending on packaging option. Materials do not require a cure/dry process. As a non-silicone paste, this material does not suffer from silicone oil leach or migration effects..

Product Benefits

  • Non-silicone (no migration, leach-out or contamination)
  • Excellent stability for devices operating at high temperature
  • High Thermal Conductivity (4.5 W/m.K)
  • No cure
  • Readily adopted for high volume production, tacky/thixotropic paste

Applications

Interface for semiconductors requiring low pressure or spring clamp mounting. Consumer electronics, Set-top boxes, IP routers, ECUs Memory and Power modules. CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, LED. TEC modules, Telecommunication hardware and as a gap filler for battery systems.

Additional information

More
Viscosity (50s-1)

15 – 24 Pa.s

Density (ASTM D792)

2.6 g/cm3

Colour

Grey

Flow Rate (30cc syringe, no tip, 90psi))

80 – 100 g/min

Thermal Conductivity (ASTM D5470)

4.5 W/m.K

Thermal Contact Resistance (ASTM D5470)

1 x 10-5 m2.K/W

Dielectric Strength (ASTM D149 MOD)

>5 kV/mm

Volume Resistivity (ASTM D257)

>1 x 10+11 Ω.cm

Dielectric Constant (ASTM D149)

14.7 (1 KHz)

Size (30 cc)

1, 10, 25, 50, 100

WeightN/A

Still Unsure?

Development

We offer a tailored formulation development service to meet specific customer requirements for thermal interface materials this may include:
  • Customised mechanical properties eg conformability, bond-line thickness
  • Customised thermal conductivity and thermal interface resistance
  • Epoxy, silicone, acrylic and urethane systems
  • Develop for range of deposition systems
  • Application testing, process development and modelling at our UK R&D technology development centre
  • Training

Applications

  • Consumer electronics
  • Set-top boxes,
  • IP routers
  • ECUs Memory
  • Power modules eg IGBTs
  • LED
  • CPU to Heat sink
  • Rectifiers
  • Gap filler for batteries