DM-IN-7021S is a screen printed thermally cured Insulator paste that offers excellent mechanical hardness for applications such as sensors and multi-layer devices.

£170.39£372.74

p

Sample pricing available for on-line purchasing only, please contact us directly for competitive bulk pricing

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Product Description

Dycotec DM-IN-7021S is a thermally cured insulator paste for general use in electronic applications for rigid substrates. The screen printed thermally cured insulator paste is oven cured at 120-130˚C. The high abrasion resistance provides a robust surface for further processing such as printing additional electronic layers on top of the insulator layer. This layer can be overprinted with conductive inks provided by Dycotec Materials such as DM-SIP-3060S.

Product Benefits

  • Good printability
  • Use in sequential build up structures
  • Low temperature cure
  • Electrically insulating
  • Use on flexible substrates

Paste Preparation

DM-IN-7021S is a single part paste system. The paste should be gently stirred before use, avoid rapid stirring to prevent air entrapment. Once the paste has been removed from the container for printing, this may introduce contamination. Please do not replace the paste in the container.

Additional information

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Size (g)

100g, 250g, 1Kg

Viscosity after mixing (Pa.s)

3 – 8

Substrate

FR4, Metal, Plastic

Screen

180 mesh count / inch SS, 13 µm emulsion

Flood Speed

50 mm/s

Print Speed

50 mm/s

Squeegee Hardness

80A Durometer Shore

Squeegee Pressure

5 Kg

Squeegee Angle

60o

Cure Temperature (oC)

120-130 deg.C

Cure Time (mins)

>10 mins

Adhesion

5B ASTM D3359

Hardness

>3H

Volume Resistivity

>1 x 10^12 Ω.cm

WeightN/A

Still Unsure?

Development

We offer a tailored formulation development service to meet specific customer overcoat requirements.  We have experience of developing systems for specific customer applications, with different properties including:
  • Barrier Layer
  • Chemical resistance
  • High temperature resistance
  • Rheology changes to enable use of different deposition techniques
  • Flexibility
  • Polyurethane, silicone and epoxy systems

Applications

  • Sensors
  • Multi-layer printed circuit board
  • Heaters