Encapsulant & Underfill

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Dycotec Encapsulant & Underfill  Products

Our encapsulants, glop-tops and underfills are used in numerous applications including wearables, In-Mold Electronics (IME) and general protection for hybrid printed electronics applications. The benefits of these pastes include:

  • Syringe deposition
  • Stretchable/flexible underfills 
  • Protection during wash cycles
  • Single part systems
  • Raid cure

Benefits of our encapsulants, glob-top and underfill systems include:

We provide our materials to a global customer base, offering a flexible delivery service from low volume samples to high volume to meet our customer’s production needs.

We also develop tailored formulations. Please contact us for more information if you require a customised adhesive paste system.

Application information may also be available on request.