Encapsulant & Underfill
Dycotec Encapsulant & Underfill Products
Our encapsulants, glop-tops and underfills are used in numerous applications including wearables, In-Mold Electronics (IME) and general protection for hybrid printed electronics applications. The benefits of these pastes include:
- Syringe deposition
- Stretchable/flexible underfills
- Protection during wash cycles
- Single part systems
- Raid cure
Benefits of our encapsulants, glob-top and underfill systems include:
We provide our materials to a global customer base, offering a flexible delivery service from low volume samples to high volume to meet our customer’s production needs.
We also develop tailored formulations. Please contact us for more information if you require a customised adhesive paste system.
Application information may also be available on request.